{"schemaVersion":"jobsearcher.job.v1","id":"4dcbb8a01056187fd90d86eb","url":"https://jobsearcher.com/jobs/4dcbb8a01056187fd90d86eb","canonicalUrl":"https://jobsearcher.com/jobs/4dcbb8a01056187fd90d86eb","title":"Semiconductor Thermal & Packaging Engineer","description":"Intel Corporation in the United States (Phoenix, AZ) seeks a Semiconductor Research Engineer to drive innovation in devices, packaging, and interconnects. You will design, simulate, and prototype advanced packaging solutions, conducting hands-on experiments and collaborating across teams to advance performance and cost-efficiency.\r\nThe role emphasizes device physics, thermomechanical analysis, and materials science, with opportunities to lead experiments, develop models, and engage external#J-18808-Ljbffr","company":"Intel","rawCompany":"intel","city":"Phoenix","state":"AZ","isRemote":false,"isActive":false,"createdAt":"2026-10-10T01:22:33.089Z","occupations":[{"code":"17-2061.00","title":"Computer Hardware Engineers","slug":"computer-hardware-engineers"},{"code":"51-9141.00","title":"Semiconductor Processing Technicians","slug":"semiconductor-processing-technicians"},{"code":"17-2199.06","title":"Microsystems Engineers","slug":"microsystems-engineers"}],"industries":[{"code":"334413","title":"Semiconductor and Related Device Manufacturing","slug":"semiconductor-and-related-device-manufacturing"},{"code":"541715","title":"Research and Development in the Physical, Engineering, and Life Sciences (except Nanotechnology and Biotechnology)","slug":"research-and-development-in-the-physical-engineering-and-life-sciences-except-nanotechnology-and-biotechnology"},{"code":"333242","title":"Semiconductor Machinery Manufacturing","slug":"semiconductor-machinery-manufacturing"}],"jobPosting":{"@context":"https://schema.org","@type":"JobPosting","title":"Semiconductor Thermal & Packaging Engineer","description":"Intel Corporation in the United States (Phoenix, AZ) seeks a Semiconductor Research Engineer to drive innovation in devices, packaging, and interconnects. You will design, simulate, and prototype advanced packaging solutions, conducting hands-on experiments and collaborating across teams to advance performance and cost-efficiency.\r\nThe role emphasizes device physics, thermomechanical analysis, and materials science, with opportunities to lead experiments, develop models, and engage external#J-18808-Ljbffr","datePosted":"2026-10-10T01:22:33.089Z","dateModified":"2026-10-10T01:22:33.089Z","hiringOrganization":{"@type":"Organization","name":"Intel","sameAs":"https://jobsearcher.com"},"jobLocation":{"@type":"Place","address":{"@type":"PostalAddress","addressLocality":"Phoenix","addressRegion":"AZ","addressCountry":"US"}},"identifier":{"@type":"PropertyValue","name":"JobSearcher","value":"4dcbb8a01056187fd90d86eb"},"url":"https://jobsearcher.com/jobs/4dcbb8a01056187fd90d86eb"}}