{"schemaVersion":"jobsearcher.job.v1","id":"4be850da7ba4280b92616c46","url":"https://jobsearcher.com/jobs/4be850da7ba4280b92616c46","canonicalUrl":"https://jobsearcher.com/jobs/4be850da7ba4280b92616c46","title":"Packaging Design Engineer: Substrate Layout & Interconnects","description":"A leading technology firm is seeking a Silicon Packaging Design Engineer in Phoenix, Arizona. This role involves end-to-end development of substrate designs, collaboration with silicon and hardware teams, and ensuring optimal cost efficiency and manufacturability. Ideal candidates will have a relevant Bachelor's or Master's degree and 1+ years of experience in microelectronic package design or PCB layout. Responsibilities include driving design layout, analyzing data, and ensuring quality standards are met. Competitive compensation and benefits are offered.\n#J-18808-Ljbffr","company":"Intel","rawCompany":"intel","city":"Phoenix","state":"AZ","isRemote":false,"isActive":false,"createdAt":"2026-06-20T03:14:05.596Z","occupations":[{"code":"17-2072.00","title":"Electronics Engineers, Except Computer","slug":"electronics-engineers-except-computer"},{"code":"17-2061.00","title":"Computer Hardware Engineers","slug":"computer-hardware-engineers"},{"code":"17-2071.00","title":"Electrical Engineers","slug":"electrical-engineers"}],"industries":[{"code":"334418","title":"Printed Circuit Assembly (Electronic Assembly) Manufacturing","slug":"printed-circuit-assembly-electronic-assembly-manufacturing"},{"code":"334413","title":"Semiconductor and Related Device Manufacturing","slug":"semiconductor-and-related-device-manufacturing"},{"code":"334419","title":"Other Electronic Component Manufacturing","slug":"other-electronic-component-manufacturing"}],"jobPosting":{"@context":"https://schema.org","@type":"JobPosting","title":"Packaging Design Engineer: Substrate Layout & Interconnects","description":"A leading technology firm is seeking a Silicon Packaging Design Engineer in Phoenix, Arizona. This role involves end-to-end development of substrate designs, collaboration with silicon and hardware teams, and ensuring optimal cost efficiency and manufacturability. Ideal candidates will have a relevant Bachelor's or Master's degree and 1+ years of experience in microelectronic package design or PCB layout. Responsibilities include driving design layout, analyzing data, and ensuring quality standards are met. Competitive compensation and benefits are offered.\n#J-18808-Ljbffr","datePosted":"2026-06-20T03:14:05.596Z","dateModified":"2026-06-20T03:14:05.596Z","hiringOrganization":{"@type":"Organization","name":"Intel","sameAs":"https://jobsearcher.com"},"jobLocation":{"@type":"Place","address":{"@type":"PostalAddress","addressLocality":"Phoenix","addressRegion":"AZ","addressCountry":"US"}},"identifier":{"@type":"PropertyValue","name":"JobSearcher","value":"4be850da7ba4280b92616c46"},"url":"https://jobsearcher.com/jobs/4be850da7ba4280b92616c46"}}