{"schemaVersion":"jobsearcher.job.v1","id":"487d825a39cc1f37d9ccbc08","url":"https://jobsearcher.com/jobs/487d825a39cc1f37d9ccbc08","canonicalUrl":"https://jobsearcher.com/jobs/487d825a39cc1f37d9ccbc08","title":"Process Development Engineer | RF Photonics","description":"OverviewIn this Senior role, you lead the development and scale-up of heterogeneous integration of non-Si modulator materials into silicon photonics. You will own and optimize HI process modules from initial development through high-volume manufacturing, collaborating with fab, design, and packaging teams to meet performance, yield, and cost targets. You'll drive robust process controls, characterization, and continuous improvement while researching differentiating techniques. This role sits within Kilby Labs, enabling lab-to-fab translation for impactful photonics solutions.Compensation / Benefitscompetitive pay and benefitsResponsibilitiesLead HI process development and optimization for die-to-wafer bonding and post-bond device processing of non-Si chiplets within silicon photonicsOwn or co-own non-Si chiplet integration processes including dicing, grinding, die-to-wafer bonding, and waveguide etchingScale HI processes from R&D to high-volume manufacturingBridge fab operations, advanced process development, and design teams to align processes with device performance and fab capabilitiesCollaborate with tool vendors and IP partners to shorten development timeWork with photonic design, architecture, and packaging to translate requirements into manufacturable, cost-efficient solutionsEstablish process controls, root-cause analysis, and yield optimization for cost and reliabilityDevelop process characterization, monitors, test structures, specs, and data correlations with device performanceMaintain process documentation and yield reporting, and pursue differentiation through new techniquesKey requirementsMaster's/PhD in Electrical Engineering, Physics, Applied Physics, or Material Science3+ years in HI-related processing for non-Si materials onto silicon photonics in high-volume fab environmentsExperience with planarization, pre-bond surface prep, die-to-wafer/wafer-to-wafer bonding, post-bond waveguide etching, metallizationKnowledge of materials such as Lithium Niobate, Lithium Tantalate, Barium Titanate, or Indium PhosphideTrack record delivering high-yield HI process modules for silicon photonicsStrong SPC, DOE, and material characterization skills for Cpk optimizationAbility to lead cross-functional collaboration between process, fab, and design teamscross-functional collaborationindependent workstrong communicationdie-to-wafer bondingwafer-to-wafer bondingplanarization and surface prep","company":"Texas Instruments","rawCompany":"texas instruments","city":"Fort Worth","state":"TX","isRemote":false,"isActive":false,"createdAt":"2026-10-26T13:22:38.952Z","occupations":[{"code":"17-2199.07","title":"Photonics Engineers","slug":"photonics-engineers"},{"code":"17-2131.00","title":"Materials Engineers","slug":"materials-engineers"},{"code":"17-2199.06","title":"Microsystems Engineers","slug":"microsystems-engineers"}],"industries":[{"code":"334413","title":"Semiconductor and Related Device Manufacturing","slug":"semiconductor-and-related-device-manufacturing"},{"code":"334419","title":"Other Electronic Component Manufacturing","slug":"other-electronic-component-manufacturing"},{"code":"541715","title":"Research and Development in the Physical, Engineering, and Life Sciences (except Nanotechnology and Biotechnology)","slug":"research-and-development-in-the-physical-engineering-and-life-sciences-except-nanotechnology-and-biotechnology"}],"jobPosting":{"@context":"https://schema.org","@type":"JobPosting","title":"Process Development Engineer | RF Photonics","description":"OverviewIn this Senior role, you lead the development and scale-up of heterogeneous integration of non-Si modulator materials into silicon photonics. You will own and optimize HI process modules from initial development through high-volume manufacturing, collaborating with fab, design, and packaging teams to meet performance, yield, and cost targets. You'll drive robust process controls, characterization, and continuous improvement while researching differentiating techniques. This role sits within Kilby Labs, enabling lab-to-fab translation for impactful photonics solutions.Compensation / Benefitscompetitive pay and benefitsResponsibilitiesLead HI process development and optimization for die-to-wafer bonding and post-bond device processing of non-Si chiplets within silicon photonicsOwn or co-own non-Si chiplet integration processes including dicing, grinding, die-to-wafer bonding, and waveguide etchingScale HI processes from R&D to high-volume manufacturingBridge fab operations, advanced process development, and design teams to align processes with device performance and fab capabilitiesCollaborate with tool vendors and IP partners to shorten development timeWork with photonic design, architecture, and packaging to translate requirements into manufacturable, cost-efficient solutionsEstablish process controls, root-cause analysis, and yield optimization for cost and reliabilityDevelop process characterization, monitors, test structures, specs, and data correlations with device performanceMaintain process documentation and yield reporting, and pursue differentiation through new techniquesKey requirementsMaster's/PhD in Electrical Engineering, Physics, Applied Physics, or Material Science3+ years in HI-related processing for non-Si materials onto silicon photonics in high-volume fab environmentsExperience with planarization, pre-bond surface prep, die-to-wafer/wafer-to-wafer bonding, post-bond waveguide etching, metallizationKnowledge of materials such as Lithium Niobate, Lithium Tantalate, Barium Titanate, or Indium PhosphideTrack record delivering high-yield HI process modules for silicon photonicsStrong SPC, DOE, and material characterization skills for Cpk optimizationAbility to lead cross-functional collaboration between process, fab, and design teamscross-functional collaborationindependent workstrong communicationdie-to-wafer bondingwafer-to-wafer bondingplanarization and surface prep","datePosted":"2026-10-26T13:22:38.952Z","dateModified":"2026-10-26T13:22:38.952Z","hiringOrganization":{"@type":"Organization","name":"Texas Instruments","sameAs":"https://jobsearcher.com"},"jobLocation":{"@type":"Place","address":{"@type":"PostalAddress","addressLocality":"Fort Worth","addressRegion":"TX","addressCountry":"US"}},"identifier":{"@type":"PropertyValue","name":"JobSearcher","value":"487d825a39cc1f37d9ccbc08"},"url":"https://jobsearcher.com/jobs/487d825a39cc1f37d9ccbc08"}}