{"schemaVersion":"jobsearcher.job.v1","id":"461aa31e548dadc86f27688a","url":"https://jobsearcher.com/jobs/461aa31e548dadc86f27688a","canonicalUrl":"https://jobsearcher.com/jobs/461aa31e548dadc86f27688a","title":"Principal Process Development Engineer","description":"Overview\nIn this role you drive backend assembly process and package development for RF power products, partnering on technology development and process optimization. You will define specifications, develop recipes, and select materials while coordinating with equipment vendors and internal teams. You lead continuous improvement, tool design, qualification, and risk mitigation to enable high-volume production. You’ll contribute to new product introductions and reliability efforts, delivering technical solutions and robust processes. This is a chance to shape scalable RF packaging solutions within a global, quality-focused organization.\n\nCompensation / BenefitsHealth, dental, and vision insuranceEmployer-sponsored 401(k) planPaid time offProfessional development opportunities\nResponsibilitiesDevelop backend assembly and package processes for RF power productsDefine specifications, guidelines, and develop process recipes; manage equipment upgrades and material selectionAnticipate issues and propose mitigation across development stagesDrive continuous improvement of processes, equipment, and materials for quality and cost savingsDesign customized tooling to adapt off-the-shelf equipment for high-volume productionVerify and qualify new tooling, machines, and materials in development projectsCollaborate with equipment vendors, subcontractors, and internal teams to qualify and debug equipmentCreate, review, and update design and equipment process FMEAProvide technical manufacturing support including troubleshooting and solutionsParticipate in new product introductions with material selection and process developmentConduct risk assessments and regular project reviews with executive reportingCoordinate initial mechanical reliability tests and root-cause failure analysis\nKey requirementsBS/MS in mechanical, material, industrial engineering, material engineering, applied science, or related8+ years in package and assembly process development (die attach, SMT, lid attach)Experience with die bond equipment (Datacon EVO)Hands-on knowledge of semiconductor backend assembly for RF power packagesProficient in FMEA/DFMEA/PFMEA, SPC, Pareto analysis, control charts, 8D, and DoEProven project management and effective communication; ability to document and report clearlyKnowledge of semiconductor reliability standards, test methods, materials characterization, and FA techniquesExperience in low-, medium-, and high-volume manufacturing for RF power products preferredproject managementclear communication and reportingrisk pre-emption and proactive problem solvingRF power packagingdie attach, SMT, lid attach processesFMEA/DFMEA/PFMEA, DoE","company":"Macom","rawCompany":"macom","city":"San Jose","state":"CA","isRemote":false,"isActive":true,"createdAt":"2026-09-15T04:12:38.950Z","occupations":[{"code":"17-2112.03","title":"Manufacturing Engineers","slug":"manufacturing-engineers"},{"code":"17-2141.00","title":"Mechanical Engineers","slug":"mechanical-engineers"},{"code":"17-2072.00","title":"Electronics Engineers, Except Computer","slug":"electronics-engineers-except-computer"}],"industries":[{"code":"334419","title":"Other Electronic Component Manufacturing","slug":"other-electronic-component-manufacturing"},{"code":"334413","title":"Semiconductor and Related Device Manufacturing","slug":"semiconductor-and-related-device-manufacturing"},{"code":"333242","title":"Semiconductor Machinery Manufacturing","slug":"semiconductor-machinery-manufacturing"}],"jobPosting":{"@context":"https://schema.org","@type":"JobPosting","title":"Principal Process Development Engineer","description":"Overview\nIn this role you drive backend assembly process and package development for RF power products, partnering on technology development and process optimization. You will define specifications, develop recipes, and select materials while coordinating with equipment vendors and internal teams. You lead continuous improvement, tool design, qualification, and risk mitigation to enable high-volume production. You’ll contribute to new product introductions and reliability efforts, delivering technical solutions and robust processes. This is a chance to shape scalable RF packaging solutions within a global, quality-focused organization.\n\nCompensation / BenefitsHealth, dental, and vision insuranceEmployer-sponsored 401(k) planPaid time offProfessional development opportunities\nResponsibilitiesDevelop backend assembly and package processes for RF power productsDefine specifications, guidelines, and develop process recipes; manage equipment upgrades and material selectionAnticipate issues and propose mitigation across development stagesDrive continuous improvement of processes, equipment, and materials for quality and cost savingsDesign customized tooling to adapt off-the-shelf equipment for high-volume productionVerify and qualify new tooling, machines, and materials in development projectsCollaborate with equipment vendors, subcontractors, and internal teams to qualify and debug equipmentCreate, review, and update design and equipment process FMEAProvide technical manufacturing support including troubleshooting and solutionsParticipate in new product introductions with material selection and process developmentConduct risk assessments and regular project reviews with executive reportingCoordinate initial mechanical reliability tests and root-cause failure analysis\nKey requirementsBS/MS in mechanical, material, industrial engineering, material engineering, applied science, or related8+ years in package and assembly process development (die attach, SMT, lid attach)Experience with die bond equipment (Datacon EVO)Hands-on knowledge of semiconductor backend assembly for RF power packagesProficient in FMEA/DFMEA/PFMEA, SPC, Pareto analysis, control charts, 8D, and DoEProven project management and effective communication; ability to document and report clearlyKnowledge of semiconductor reliability standards, test methods, materials characterization, and FA techniquesExperience in low-, medium-, and high-volume manufacturing for RF power products preferredproject managementclear communication and reportingrisk pre-emption and proactive problem solvingRF power packagingdie attach, SMT, lid attach processesFMEA/DFMEA/PFMEA, DoE","datePosted":"2026-09-15T04:12:38.950Z","dateModified":"2026-09-15T04:12:38.950Z","hiringOrganization":{"@type":"Organization","name":"Macom","sameAs":"https://jobsearcher.com"},"jobLocation":{"@type":"Place","address":{"@type":"PostalAddress","addressLocality":"San Jose","addressRegion":"CA","addressCountry":"US"}},"identifier":{"@type":"PropertyValue","name":"JobSearcher","value":"461aa31e548dadc86f27688a"},"url":"https://jobsearcher.com/jobs/461aa31e548dadc86f27688a"}}