{"schemaVersion":"jobsearcher.job.v1","id":"438557106617bfb9954f3452","url":"https://jobsearcher.com/jobs/438557106617bfb9954f3452","canonicalUrl":"https://jobsearcher.com/jobs/438557106617bfb9954f3452","title":"Dry Etch Process Develop Engineer","description":"Job Summary Dry Etch Process Engineer at Micron Technology's Technology Development organization. Responsible for developing, integrating, and optimizing plasma etch processes for next‑generation memory devices. Collaborates with integration, lithography, thin‑film, CMP, device, and manufacturing teams to mature processes from R&D to high‑volume manufacturing. Full‑time position located at Albany, New York (NYC site). Works closely with EUV Photo Lithography team and Technology Development teams in Boise, USA and Hiroshima, Japan.\nResponsibilities Develop, qualify, and sustain dry etch (plasma) unit processes for advanced memory technologies (dielectric, conductor, hardmask).\nOptimize critical process metrics including critical dimension control, etch profile/anisotropy, selectivity, microloading, uniformity, and line‑edge/line‑width roughness.\nDrive defect reduction and yield improvement using inline/out‑of‑line metrology, DOEs, SPC, and statistical data analysis.\nPerform root‑cause analysis and implement corrective actions for process excursions, tool health issues, and integration‑related failures.\nPartner with equipment vendors on chamber matching, hardware and recipe development, new capability evaluations, and cost‑of‑ownership improvements.\nDocument process baselines, change controls, and learnings; communicate results and support technology transfer to high‑volume manufacturing.\nMinimum Qualifications M.S. or Ph.D. in Electrical Engineering, Materials Science, Physics, Chemistry, Chemical Engineering, Mechanical Engineering, or a related engineering/technical field relevant to plasma processing and semiconductor manufacturing.\nB.S. with 3+ years of semiconductor processing experience with emphasis on dry etch/plasma etch (also considered).\nExperience in semiconductor process development or sustaining engineering, including DOE planning/execution and statistical data analysis.\nWorking knowledge of plasma etch fundamentals, chamber hardware, and process characterization (profile, CD, selectivity, uniformity, defectivity).\nAbility to collaborate effectively across cross‑functional technical teams and communicate results clearly.\nPreferred Qualifications Hands‑on experience with advanced dry etch platforms (e.g., ICP/RIE) and chamber matching across fleets.\nFamiliarity with pattern transfer challenges (ARDE, microloading, footing/notching) and integration with lithography/hardmask stacks.\nExperience with defect characterization techniques and tool health monitoring methodologies.\nExperience working with semiconductor equipment vendors, joint development programs, or R&D environments.\nFamiliarity with technology transfer to high‑volume manufacturing and sustaining support in a fab environment.\nSalary Estimated range: $107,000.00 – $182,000.00 per year (base). Additional compensation may include benefits, bonuses, and equity.\nBenefits Medical, dental, and vision plans.\nIncome protection for illness or injury.\nPaid time‑off program and paid holidays.\nPaid family leave.\nRobust benefit programs that help protect income and prepare for the future.\nEqual Employment Opportunity Micron is an equal‑opportunity workplace and an affirmative action employer. All qualified applicants will receive consideration for employment without regard to race, color, religion, sex, sexual orientation, age, national origin, citizenship status, disability, protected veteran status, gender identity, or any other factor protected by applicable federal, state, or local laws.\n\n#J-18808-Ljbffr","company":"1000 Micron Technology","rawCompany":"1000 micron technology","city":"Albany","state":"NY","isRemote":false,"isActive":true,"createdAt":"2026-07-10T03:32:26.710Z","occupations":[{"code":"51-9141.00","title":"Semiconductor Processing Technicians","slug":"semiconductor-processing-technicians"},{"code":"17-2199.06","title":"Microsystems Engineers","slug":"microsystems-engineers"},{"code":"17-2199.09","title":"Nanosystems Engineers","slug":"nanosystems-engineers"}],"industries":[{"code":"334413","title":"Semiconductor and Related Device Manufacturing","slug":"semiconductor-and-related-device-manufacturing"},{"code":"333242","title":"Semiconductor Machinery Manufacturing","slug":"semiconductor-machinery-manufacturing"},{"code":"334419","title":"Other Electronic Component Manufacturing","slug":"other-electronic-component-manufacturing"}],"jobPosting":{"@context":"https://schema.org","@type":"JobPosting","title":"Dry Etch Process Develop Engineer","description":"Job Summary Dry Etch Process Engineer at Micron Technology's Technology Development organization. Responsible for developing, integrating, and optimizing plasma etch processes for next‑generation memory devices. Collaborates with integration, lithography, thin‑film, CMP, device, and manufacturing teams to mature processes from R&D to high‑volume manufacturing. Full‑time position located at Albany, New York (NYC site). Works closely with EUV Photo Lithography team and Technology Development teams in Boise, USA and Hiroshima, Japan.\nResponsibilities Develop, qualify, and sustain dry etch (plasma) unit processes for advanced memory technologies (dielectric, conductor, hardmask).\nOptimize critical process metrics including critical dimension control, etch profile/anisotropy, selectivity, microloading, uniformity, and line‑edge/line‑width roughness.\nDrive defect reduction and yield improvement using inline/out‑of‑line metrology, DOEs, SPC, and statistical data analysis.\nPerform root‑cause analysis and implement corrective actions for process excursions, tool health issues, and integration‑related failures.\nPartner with equipment vendors on chamber matching, hardware and recipe development, new capability evaluations, and cost‑of‑ownership improvements.\nDocument process baselines, change controls, and learnings; communicate results and support technology transfer to high‑volume manufacturing.\nMinimum Qualifications M.S. or Ph.D. in Electrical Engineering, Materials Science, Physics, Chemistry, Chemical Engineering, Mechanical Engineering, or a related engineering/technical field relevant to plasma processing and semiconductor manufacturing.\nB.S. with 3+ years of semiconductor processing experience with emphasis on dry etch/plasma etch (also considered).\nExperience in semiconductor process development or sustaining engineering, including DOE planning/execution and statistical data analysis.\nWorking knowledge of plasma etch fundamentals, chamber hardware, and process characterization (profile, CD, selectivity, uniformity, defectivity).\nAbility to collaborate effectively across cross‑functional technical teams and communicate results clearly.\nPreferred Qualifications Hands‑on experience with advanced dry etch platforms (e.g., ICP/RIE) and chamber matching across fleets.\nFamiliarity with pattern transfer challenges (ARDE, microloading, footing/notching) and integration with lithography/hardmask stacks.\nExperience with defect characterization techniques and tool health monitoring methodologies.\nExperience working with semiconductor equipment vendors, joint development programs, or R&D environments.\nFamiliarity with technology transfer to high‑volume manufacturing and sustaining support in a fab environment.\nSalary Estimated range: $107,000.00 – $182,000.00 per year (base). Additional compensation may include benefits, bonuses, and equity.\nBenefits Medical, dental, and vision plans.\nIncome protection for illness or injury.\nPaid time‑off program and paid holidays.\nPaid family leave.\nRobust benefit programs that help protect income and prepare for the future.\nEqual Employment Opportunity Micron is an equal‑opportunity workplace and an affirmative action employer. All qualified applicants will receive consideration for employment without regard to race, color, religion, sex, sexual orientation, age, national origin, citizenship status, disability, protected veteran status, gender identity, or any other factor protected by applicable federal, state, or local laws.\n\n#J-18808-Ljbffr","datePosted":"2026-07-10T03:32:26.710Z","dateModified":"2026-07-10T03:32:26.710Z","hiringOrganization":{"@type":"Organization","name":"1000 Micron Technology","sameAs":"https://jobsearcher.com"},"jobLocation":{"@type":"Place","address":{"@type":"PostalAddress","addressLocality":"Albany","addressRegion":"NY","addressCountry":"US"}},"identifier":{"@type":"PropertyValue","name":"JobSearcher","value":"438557106617bfb9954f3452"},"url":"https://jobsearcher.com/jobs/438557106617bfb9954f3452"}}