{"schemaVersion":"jobsearcher.job.v1","id":"435568ab484b460a00103404","url":"https://jobsearcher.com/jobs/435568ab484b460a00103404","canonicalUrl":"https://jobsearcher.com/jobs/435568ab484b460a00103404","title":"Packaging Multiphysics Simulation Engineer","description":"Intel is seeking a Mechanical Engineer for the Advanced Packaging Mechanical Analysis team in Chandler, AZ. This position focuses on developing advanced finite element analysis simulations for semiconductor packaging, requiring regular onsite presence.\nThe ideal candidate will possess a PhD in Mechanical Engineering and relevant experience in thermal-mechanical research and Finite Element Analysis tools. The role offers a competitive salary and benefits package, reflecting the industry’s best.\n\n#J-18808-Ljbffr","company":"Intel","rawCompany":"intel","city":"Phoenix","state":"AZ","isRemote":false,"isActive":false,"createdAt":"2026-07-16T03:22:27.248Z","occupations":[{"code":"17-2141.00","title":"Mechanical Engineers","slug":"mechanical-engineers"},{"code":"17-2112.03","title":"Manufacturing Engineers","slug":"manufacturing-engineers"},{"code":"17-2199.00","title":"Engineers, All Other","slug":"engineers-all-other"}],"industries":[{"code":"333242","title":"Semiconductor Machinery Manufacturing","slug":"semiconductor-machinery-manufacturing"},{"code":"541715","title":"Research and Development in the Physical, Engineering, and Life Sciences (except Nanotechnology and Biotechnology)","slug":"research-and-development-in-the-physical-engineering-and-life-sciences-except-nanotechnology-and-biotechnology"},{"code":"334413","title":"Semiconductor and Related Device Manufacturing","slug":"semiconductor-and-related-device-manufacturing"}],"jobPosting":{"@context":"https://schema.org","@type":"JobPosting","title":"Packaging Multiphysics Simulation Engineer","description":"Intel is seeking a Mechanical Engineer for the Advanced Packaging Mechanical Analysis team in Chandler, AZ. This position focuses on developing advanced finite element analysis simulations for semiconductor packaging, requiring regular onsite presence.\nThe ideal candidate will possess a PhD in Mechanical Engineering and relevant experience in thermal-mechanical research and Finite Element Analysis tools. The role offers a competitive salary and benefits package, reflecting the industry’s best.\n\n#J-18808-Ljbffr","datePosted":"2026-07-16T03:22:27.248Z","dateModified":"2026-07-16T03:22:27.248Z","hiringOrganization":{"@type":"Organization","name":"Intel","sameAs":"https://jobsearcher.com"},"jobLocation":{"@type":"Place","address":{"@type":"PostalAddress","addressLocality":"Phoenix","addressRegion":"AZ","addressCountry":"US"}},"identifier":{"@type":"PropertyValue","name":"JobSearcher","value":"435568ab484b460a00103404"},"url":"https://jobsearcher.com/jobs/435568ab484b460a00103404"}}