{"schemaVersion":"jobsearcher.job.v1","id":"4122545fa7f42dcddfff7c6d","url":"https://jobsearcher.com/jobs/4122545fa7f42dcddfff7c6d","canonicalUrl":"https://jobsearcher.com/jobs/4122545fa7f42dcddfff7c6d","title":"Lead 2.5D/3D IC Package Layout Engineer","description":"Annapurna Labs (U.S.) Inc. in Cupertino seeks a Sr. Package Layout Engineer to own end-to-end physical design of advanced IC packages for next‑gen ML and data center ASICs.\nYou will oversee the package layout from floor planning through tape‑out, coordinating with silicon, SI/PI, and manufacturing teams to meet performance and reliability targets. You will define floorplans, drive RDL/substrate routing, and ensure design-for-manufacturing alignment with OSAT partners, while mentoring junior\n\n#J-18808-Ljbffr","company":"Amazon","rawCompany":"amazon","city":"Cupertino","state":"CA","isRemote":false,"isActive":false,"createdAt":"2026-07-16T04:12:26.946Z","occupations":[{"code":"17-2061.00","title":"Computer Hardware Engineers","slug":"computer-hardware-engineers"},{"code":"17-2072.00","title":"Electronics Engineers, Except Computer","slug":"electronics-engineers-except-computer"},{"code":"15-1299.08","title":"Computer Systems Engineers/Architects","slug":"computer-systems-engineers-architects"}],"industries":[{"code":"334413","title":"Semiconductor and Related Device Manufacturing","slug":"semiconductor-and-related-device-manufacturing"},{"code":"334418","title":"Printed Circuit Assembly (Electronic Assembly) Manufacturing","slug":"printed-circuit-assembly-electronic-assembly-manufacturing"},{"code":"334111","title":"Electronic Computer Manufacturing","slug":"electronic-computer-manufacturing"}],"jobPosting":{"@context":"https://schema.org","@type":"JobPosting","title":"Lead 2.5D/3D IC Package Layout Engineer","description":"Annapurna Labs (U.S.) Inc. in Cupertino seeks a Sr. Package Layout Engineer to own end-to-end physical design of advanced IC packages for next‑gen ML and data center ASICs.\nYou will oversee the package layout from floor planning through tape‑out, coordinating with silicon, SI/PI, and manufacturing teams to meet performance and reliability targets. You will define floorplans, drive RDL/substrate routing, and ensure design-for-manufacturing alignment with OSAT partners, while mentoring junior\n\n#J-18808-Ljbffr","datePosted":"2026-07-16T04:12:26.946Z","dateModified":"2026-07-16T04:12:26.946Z","hiringOrganization":{"@type":"Organization","name":"Amazon","sameAs":"https://jobsearcher.com"},"jobLocation":{"@type":"Place","address":{"@type":"PostalAddress","addressLocality":"Cupertino","addressRegion":"CA","addressCountry":"US"}},"identifier":{"@type":"PropertyValue","name":"JobSearcher","value":"4122545fa7f42dcddfff7c6d"},"url":"https://jobsearcher.com/jobs/4122545fa7f42dcddfff7c6d"}}