{"schemaVersion":"jobsearcher.job.v1","id":"4082a488373480980101a8a8","url":"https://jobsearcher.com/jobs/4082a488373480980101a8a8","canonicalUrl":"https://jobsearcher.com/jobs/4082a488373480980101a8a8","title":"Packaging Process Development Engineer","description":"OverviewIn this role you will advance next-generation semiconductor packaging technologies by developing and optimizing assembly processes and equipment. You will work within Intel's Packaging Module Development team to improve quality, reliability, yield, and manufacturability of prototypes. You will collaborate cross-functionally to align with supplier quality and product milestones, driving continuous improvement and measurable impact on product performance. This is a hands-on position at the cutting edge of packaging technology with a strong focus on reliability and manufacturability.Compensation / Benefitscompetitive paystock bonuseshealth benefitsretirement plansvacationResponsibilitiesDevelop and optimize assembly media and collaterals to meet quality, reliability, cost, yield, productivity, and manufacturability targetsApply DOE and SPC to refine media and collateral capabilities and document findings in technical reportsDesign and maintain equipment to evaluate media and collateral performance under simulated field conditionsEnsure manufacturability of physical prototypes and oversee full lifecycle of manufacturing workflowsDefine material specifications and collaborate with supplier quality and procurement to maintain complianceLeverage failure mechanism knowledge to establish reliability benchmarks aligned with customer requirementsLead problem-solving initiatives and drive continuous improvement for media and collateralsStandardize manufacturing qualification practices and manage technical risks in line with milestones and supplier deliveryServe as a subject matter expert, providing technical consultation on media and collateral solutionsKey requirementsBachelor's degree in Mechanical Engineering, Materials Science, Metallurgical Engineering, or related STEM field with 2+ years experience OR Master's degree in mechanical engineering, Materials Science, Metallurgical Engineering, or related STEM fieldKnowledge of mechanical design software such as SolidWorks or AutoCADMechanical drawings, Geometric Dimensioning and Tolerancing (GD&T) principlesPreferred: 2+ years experience in SPC and DOE methodologiesExperience with high-precision manufacturing methods, stamping and CNC machiningKnowledge of semiconductor fabrication processes and packaging technologiesExperience with supply chain management in a manufacturing or materials qualification environmentCollaborative mindsetAnalytical thinkingEffective communicationStatistical Process Control (SPC)Design of Experiments (DOE)High-precision manufacturing methods (stamping, CNC machining)","company":"Intel","rawCompany":"intel","city":"Scottsdale","state":"AZ","isRemote":false,"isActive":false,"createdAt":"2026-10-26T14:28:02.365Z","occupations":[{"code":"17-2141.00","title":"Mechanical Engineers","slug":"mechanical-engineers"},{"code":"17-2112.03","title":"Manufacturing Engineers","slug":"manufacturing-engineers"},{"code":"17-2199.06","title":"Microsystems Engineers","slug":"microsystems-engineers"}],"industries":[{"code":"333242","title":"Semiconductor Machinery Manufacturing","slug":"semiconductor-machinery-manufacturing"},{"code":"334413","title":"Semiconductor and Related Device Manufacturing","slug":"semiconductor-and-related-device-manufacturing"},{"code":"334111","title":"Electronic Computer Manufacturing","slug":"electronic-computer-manufacturing"}],"jobPosting":{"@context":"https://schema.org","@type":"JobPosting","title":"Packaging Process Development Engineer","description":"OverviewIn this role you will advance next-generation semiconductor packaging technologies by developing and optimizing assembly processes and equipment. You will work within Intel's Packaging Module Development team to improve quality, reliability, yield, and manufacturability of prototypes. You will collaborate cross-functionally to align with supplier quality and product milestones, driving continuous improvement and measurable impact on product performance. This is a hands-on position at the cutting edge of packaging technology with a strong focus on reliability and manufacturability.Compensation / Benefitscompetitive paystock bonuseshealth benefitsretirement plansvacationResponsibilitiesDevelop and optimize assembly media and collaterals to meet quality, reliability, cost, yield, productivity, and manufacturability targetsApply DOE and SPC to refine media and collateral capabilities and document findings in technical reportsDesign and maintain equipment to evaluate media and collateral performance under simulated field conditionsEnsure manufacturability of physical prototypes and oversee full lifecycle of manufacturing workflowsDefine material specifications and collaborate with supplier quality and procurement to maintain complianceLeverage failure mechanism knowledge to establish reliability benchmarks aligned with customer requirementsLead problem-solving initiatives and drive continuous improvement for media and collateralsStandardize manufacturing qualification practices and manage technical risks in line with milestones and supplier deliveryServe as a subject matter expert, providing technical consultation on media and collateral solutionsKey requirementsBachelor's degree in Mechanical Engineering, Materials Science, Metallurgical Engineering, or related STEM field with 2+ years experience OR Master's degree in mechanical engineering, Materials Science, Metallurgical Engineering, or related STEM fieldKnowledge of mechanical design software such as SolidWorks or AutoCADMechanical drawings, Geometric Dimensioning and Tolerancing (GD&T) principlesPreferred: 2+ years experience in SPC and DOE methodologiesExperience with high-precision manufacturing methods, stamping and CNC machiningKnowledge of semiconductor fabrication processes and packaging technologiesExperience with supply chain management in a manufacturing or materials qualification environmentCollaborative mindsetAnalytical thinkingEffective communicationStatistical Process Control (SPC)Design of Experiments (DOE)High-precision manufacturing methods (stamping, CNC machining)","datePosted":"2026-10-26T14:28:02.365Z","dateModified":"2026-10-26T14:28:02.365Z","hiringOrganization":{"@type":"Organization","name":"Intel","sameAs":"https://jobsearcher.com"},"jobLocation":{"@type":"Place","address":{"@type":"PostalAddress","addressLocality":"Scottsdale","addressRegion":"AZ","addressCountry":"US"}},"identifier":{"@type":"PropertyValue","name":"JobSearcher","value":"4082a488373480980101a8a8"},"url":"https://jobsearcher.com/jobs/4082a488373480980101a8a8"}}