{"schemaVersion":"jobsearcher.job.v1","id":"3b9727e7eb644a12f5b667e9","url":"https://jobsearcher.com/jobs/3b9727e7eb644a12f5b667e9","canonicalUrl":"https://jobsearcher.com/jobs/3b9727e7eb644a12f5b667e9","title":"Lead Memory Packaging Engineer - High-Speed DRAM & HVM","description":"Micron Technology in Boise, Idaho seeks a Senior Package Design Engineer to lead co-design activities for advanced DRAM and memory products. You will collaborate globally with cross-functional teams to define and drive product concepts.\nIdeal candidates will have a Master's degree in Electrical Engineering or a related field combined with extensive hands-on experience in semiconductor package design. Micron offers robust benefits and a supportive work environment.\n\n#J-18808-Ljbffr","company":"Micron Technology","rawCompany":"micron technology","city":"Boise","state":"ID","isRemote":false,"isActive":false,"createdAt":"2026-07-16T03:49:07.226Z","occupations":[{"code":"17-2199.06","title":"Microsystems Engineers","slug":"microsystems-engineers"},{"code":"17-2061.00","title":"Computer Hardware Engineers","slug":"computer-hardware-engineers"},{"code":"17-2072.00","title":"Electronics Engineers, Except Computer","slug":"electronics-engineers-except-computer"}],"industries":[{"code":"334413","title":"Semiconductor and Related Device Manufacturing","slug":"semiconductor-and-related-device-manufacturing"},{"code":"334112","title":"Computer Storage Device Manufacturing","slug":"computer-storage-device-manufacturing"},{"code":"333242","title":"Semiconductor Machinery Manufacturing","slug":"semiconductor-machinery-manufacturing"}],"jobPosting":{"@context":"https://schema.org","@type":"JobPosting","title":"Lead Memory Packaging Engineer - High-Speed DRAM & HVM","description":"Micron Technology in Boise, Idaho seeks a Senior Package Design Engineer to lead co-design activities for advanced DRAM and memory products. You will collaborate globally with cross-functional teams to define and drive product concepts.\nIdeal candidates will have a Master's degree in Electrical Engineering or a related field combined with extensive hands-on experience in semiconductor package design. Micron offers robust benefits and a supportive work environment.\n\n#J-18808-Ljbffr","datePosted":"2026-07-16T03:49:07.226Z","dateModified":"2026-07-16T03:49:07.226Z","hiringOrganization":{"@type":"Organization","name":"Micron Technology","sameAs":"https://jobsearcher.com"},"jobLocation":{"@type":"Place","address":{"@type":"PostalAddress","addressLocality":"Boise","addressRegion":"ID","addressCountry":"US"}},"identifier":{"@type":"PropertyValue","name":"JobSearcher","value":"3b9727e7eb644a12f5b667e9"},"url":"https://jobsearcher.com/jobs/3b9727e7eb644a12f5b667e9"}}