{"schemaVersion":"jobsearcher.job.v1","id":"39d8f3c4d5b3178d2a0e1129","url":"https://jobsearcher.com/jobs/39d8f3c4d5b3178d2a0e1129","canonicalUrl":"https://jobsearcher.com/jobs/39d8f3c4d5b3178d2a0e1129","title":"Senior Semiconductor Process Engineer","description":"Role Overview\nYou will be a Focal Plane Array Process Engineer with our Infrared Sensors Business on site in Goleta, CA. Our team is responsible for developing and manufacturing advanced FPAs and we are looking for a talented engineer to join our team.\n\nWhat You Will Be Doing\nAs a Senior FPA Process Engineer, you will be the subject‑matter expert for fabrication and execution of advanced Focal Plane Arrays, including wicking, substrate thinning, dicing, and flip‑chip bonding for hybridization. You will play a critical role in developing and optimizing processes, procedures, tooling, and equipment to maximize yield, efficiency, and throughput, and in precisely aligning and bonding detector arrays and read‑out integrated circuits (ROICs) to create high‑performance FPAs.\n\nYour responsibilities include, but are not limited to:\n\nWork with development and process integration engineers to adapt new processes and techniques into the manufacturing line, including defining requirements for new capabilities and leading FPA processing equipment capital procurement projects.\n\nLead projects related to process definition, fabrication, modification, and evaluation of FPA devices and components.\n\nAnalyze test data, identify trends and anomalies, and provide feedback to drive process control and improvement initiatives. Contribute to troubleshooting and failure analysis of FPAs, identifying root causes and implementing corrective actions.\n\nDevelop and maintain documentation, including workflows, work instructions, and process control checklists, ensuring adherence to quality standards and industry protocols.\n\nBasic Qualifications\n\nBachelor’s degree in Material Science, Engineering, Physics, or related discipline.\n\n3+ years of experience in semiconductor packaging or FPA manufacturing in a cleanroom environment, with demonstrated expertise in flip‑chip hybridization techniques or related processes such as epoxy die attach/bonding, polishing, substrate removal, or AR coating.\n\nMust be a U.S. citizen, as the position requires special facility access.\n\nDesired Skills\n\nMaster’s degree or Ph.D. in Engineering, Physics, or related discipline.\n\nBackground in IR FPA packaging, specifically flip‑chip hybridization.\n\nKnowledge of semiconductor device physics, photodetectors, and FPAs.\n\nProficiency in MS Office (Word, PowerPoint, Excel).\n\nExcellent engineering documentation and communication skills.\n\nAbility to collaborate effectively with cross‑functional teams and train technical staff.\n\nExperience with Design of Experiments (DOE), statistical process control (SPC), and data analysis software such as JMP or MATLAB.\n\nExperience with Lean/Six Sigma methodologies.\n\nCompensation\nAnnual base salary range in California: $93,200 – $164,450. Additional compensation may reflect location and experience.\n\nBenefits\nMedical, Dental, Vision, Life Insurance, Short‑Term Disability, Long‑Term Disability, 401(k) match, Flexible Spending Accounts, EAP, Education Assistance, Parental Leave, Paid Time Off, and Holidays.\n\nEmployment Details\nFull‑time, first shift, 4×10‑hour day schedule with 3 days off per week.\n\nLockheed Martin is an equal opportunity employer. Qualified candidates will be considered without regard to legally protected characteristics.\n\n#J-18808-Ljbffr","company":"Lockheed Martin","rawCompany":"lockheed martin","city":"Santa Barbara","state":"CA","isRemote":false,"isActive":false,"createdAt":"2026-06-17T04:22:21.936Z","occupations":[{"code":"51-9141.00","title":"Semiconductor Processing Technicians","slug":"semiconductor-processing-technicians"},{"code":"17-2199.06","title":"Microsystems Engineers","slug":"microsystems-engineers"},{"code":"17-2072.00","title":"Electronics Engineers, Except Computer","slug":"electronics-engineers-except-computer"}],"industries":[{"code":"334413","title":"Semiconductor and Related Device Manufacturing","slug":"semiconductor-and-related-device-manufacturing"},{"code":"333242","title":"Semiconductor Machinery Manufacturing","slug":"semiconductor-machinery-manufacturing"},{"code":"334419","title":"Other Electronic Component Manufacturing","slug":"other-electronic-component-manufacturing"}],"jobPosting":{"@context":"https://schema.org","@type":"JobPosting","title":"Senior Semiconductor Process Engineer","description":"Role Overview\nYou will be a Focal Plane Array Process Engineer with our Infrared Sensors Business on site in Goleta, CA. Our team is responsible for developing and manufacturing advanced FPAs and we are looking for a talented engineer to join our team.\n\nWhat You Will Be Doing\nAs a Senior FPA Process Engineer, you will be the subject‑matter expert for fabrication and execution of advanced Focal Plane Arrays, including wicking, substrate thinning, dicing, and flip‑chip bonding for hybridization. You will play a critical role in developing and optimizing processes, procedures, tooling, and equipment to maximize yield, efficiency, and throughput, and in precisely aligning and bonding detector arrays and read‑out integrated circuits (ROICs) to create high‑performance FPAs.\n\nYour responsibilities include, but are not limited to:\n\nWork with development and process integration engineers to adapt new processes and techniques into the manufacturing line, including defining requirements for new capabilities and leading FPA processing equipment capital procurement projects.\n\nLead projects related to process definition, fabrication, modification, and evaluation of FPA devices and components.\n\nAnalyze test data, identify trends and anomalies, and provide feedback to drive process control and improvement initiatives. Contribute to troubleshooting and failure analysis of FPAs, identifying root causes and implementing corrective actions.\n\nDevelop and maintain documentation, including workflows, work instructions, and process control checklists, ensuring adherence to quality standards and industry protocols.\n\nBasic Qualifications\n\nBachelor’s degree in Material Science, Engineering, Physics, or related discipline.\n\n3+ years of experience in semiconductor packaging or FPA manufacturing in a cleanroom environment, with demonstrated expertise in flip‑chip hybridization techniques or related processes such as epoxy die attach/bonding, polishing, substrate removal, or AR coating.\n\nMust be a U.S. citizen, as the position requires special facility access.\n\nDesired Skills\n\nMaster’s degree or Ph.D. in Engineering, Physics, or related discipline.\n\nBackground in IR FPA packaging, specifically flip‑chip hybridization.\n\nKnowledge of semiconductor device physics, photodetectors, and FPAs.\n\nProficiency in MS Office (Word, PowerPoint, Excel).\n\nExcellent engineering documentation and communication skills.\n\nAbility to collaborate effectively with cross‑functional teams and train technical staff.\n\nExperience with Design of Experiments (DOE), statistical process control (SPC), and data analysis software such as JMP or MATLAB.\n\nExperience with Lean/Six Sigma methodologies.\n\nCompensation\nAnnual base salary range in California: $93,200 – $164,450. Additional compensation may reflect location and experience.\n\nBenefits\nMedical, Dental, Vision, Life Insurance, Short‑Term Disability, Long‑Term Disability, 401(k) match, Flexible Spending Accounts, EAP, Education Assistance, Parental Leave, Paid Time Off, and Holidays.\n\nEmployment Details\nFull‑time, first shift, 4×10‑hour day schedule with 3 days off per week.\n\nLockheed Martin is an equal opportunity employer. Qualified candidates will be considered without regard to legally protected characteristics.\n\n#J-18808-Ljbffr","datePosted":"2026-06-17T04:22:21.936Z","dateModified":"2026-06-17T04:22:21.936Z","hiringOrganization":{"@type":"Organization","name":"Lockheed Martin","sameAs":"https://jobsearcher.com"},"jobLocation":{"@type":"Place","address":{"@type":"PostalAddress","addressLocality":"Santa Barbara","addressRegion":"CA","addressCountry":"US"}},"identifier":{"@type":"PropertyValue","name":"JobSearcher","value":"39d8f3c4d5b3178d2a0e1129"},"url":"https://jobsearcher.com/jobs/39d8f3c4d5b3178d2a0e1129"}}