{"schemaVersion":"jobsearcher.job.v1","id":"375d86bda5c79cc90902c79e","url":"https://jobsearcher.com/jobs/375d86bda5c79cc90902c79e","canonicalUrl":"https://jobsearcher.com/jobs/375d86bda5c79cc90902c79e","title":"Integration Engineer","description":"ORCA Computing is developing an ultra-low loss integrated photonics platform for photonic quantum computers. Packaged devices will be deployed in real-world systems and will underpin our longer-term large-scale quantum computing architectures.\nORCA Computing is seeking a Photonic Integration Engineer to combine hands-on photonic component design with ownership of our packaging strategy. This role contributes to the design and optimization of ultra-low-loss components and PIC layouts, while owning packaging specifications, vendor relationships, and the fiber attach, wire bonding, and driver integration processes that get packaged devices to spec.\nKey Responsibilities Own packaging strategy and specifications, including fiber attach, wire bonding, and RF/driver integration\nManage relationships and specifications with external vendors from development to volume production\nMaintain state of the art fiber-PIC coupling performance from the lab to packaged deployed devices\nContribute to the design and optimization of ultra-low-loss passive photonic components and electro-optic (EO) modulators\nDevelop and refine scalable, repeatable packaging processes\nAnalyze characterization data and iterate both device- and package-level performance\nMaintain thorough documentation\nRequired Qualifications Significant industry experience in photonic or optoelectronic device packaging, including fiber attach\nWorking knowledge of thermal management and RF/driver integration considerations for packaged photonic devices\nWorking familiarity with photonic component design and simulation tools such as Lumerical MODE and FDTD\nFamiliarity with PIC fabrication processes and constraints\nMust be based in Austin, TX, with hybrid work flexibility\nPreferred Qualifications Master’s or PhD in Photonics, Physics, Electrical Engineering, or a related field\nHands-on experience with Si photonics\nFamiliarity with high-speed RF packaging and signal integrity considerations\nBackground in quantum photonics or quantum optics\n\n#J-18808-Ljbffr","company":"Orca Computing","rawCompany":"orca computing","city":"Austin","state":"TX","isRemote":false,"isActive":false,"createdAt":"2026-10-29T03:30:14.383Z","occupations":[{"code":"17-2199.07","title":"Photonics Engineers","slug":"photonics-engineers"},{"code":"17-2072.00","title":"Electronics Engineers, Except Computer","slug":"electronics-engineers-except-computer"},{"code":"19-2012.00","title":"Physicists","slug":"physicists"}],"industries":[{"code":"334419","title":"Other Electronic Component Manufacturing","slug":"other-electronic-component-manufacturing"},{"code":"334413","title":"Semiconductor and Related Device Manufacturing","slug":"semiconductor-and-related-device-manufacturing"},{"code":"334511","title":"Search, Detection, Navigation, Guidance, Aeronautical, and Nautical System and Instrument Manufacturing","slug":"search-detection-navigation-guidance-aeronautical-and-nautical-system-and-instrument-manufacturing"}],"jobPosting":{"@context":"https://schema.org","@type":"JobPosting","title":"Integration Engineer","description":"ORCA Computing is developing an ultra-low loss integrated photonics platform for photonic quantum computers. Packaged devices will be deployed in real-world systems and will underpin our longer-term large-scale quantum computing architectures.\nORCA Computing is seeking a Photonic Integration Engineer to combine hands-on photonic component design with ownership of our packaging strategy. This role contributes to the design and optimization of ultra-low-loss components and PIC layouts, while owning packaging specifications, vendor relationships, and the fiber attach, wire bonding, and driver integration processes that get packaged devices to spec.\nKey Responsibilities Own packaging strategy and specifications, including fiber attach, wire bonding, and RF/driver integration\nManage relationships and specifications with external vendors from development to volume production\nMaintain state of the art fiber-PIC coupling performance from the lab to packaged deployed devices\nContribute to the design and optimization of ultra-low-loss passive photonic components and electro-optic (EO) modulators\nDevelop and refine scalable, repeatable packaging processes\nAnalyze characterization data and iterate both device- and package-level performance\nMaintain thorough documentation\nRequired Qualifications Significant industry experience in photonic or optoelectronic device packaging, including fiber attach\nWorking knowledge of thermal management and RF/driver integration considerations for packaged photonic devices\nWorking familiarity with photonic component design and simulation tools such as Lumerical MODE and FDTD\nFamiliarity with PIC fabrication processes and constraints\nMust be based in Austin, TX, with hybrid work flexibility\nPreferred Qualifications Master’s or PhD in Photonics, Physics, Electrical Engineering, or a related field\nHands-on experience with Si photonics\nFamiliarity with high-speed RF packaging and signal integrity considerations\nBackground in quantum photonics or quantum optics\n\n#J-18808-Ljbffr","datePosted":"2026-10-29T03:30:14.383Z","dateModified":"2026-10-29T03:30:14.383Z","hiringOrganization":{"@type":"Organization","name":"Orca Computing","sameAs":"https://jobsearcher.com"},"jobLocation":{"@type":"Place","address":{"@type":"PostalAddress","addressLocality":"Austin","addressRegion":"TX","addressCountry":"US"}},"identifier":{"@type":"PropertyValue","name":"JobSearcher","value":"375d86bda5c79cc90902c79e"},"url":"https://jobsearcher.com/jobs/375d86bda5c79cc90902c79e"}}