{"schemaVersion":"jobsearcher.job.v1","id":"277ef6acecb462e3cd8cf69f","url":"https://jobsearcher.com/jobs/277ef6acecb462e3cd8cf69f","canonicalUrl":"https://jobsearcher.com/jobs/277ef6acecb462e3cd8cf69f","title":"Thin Film Process Development Engineer (Reader)","description":"TITLE: THIN FILM PROCESS DEVELOPMENT ENGINEER (READER)\nFLSA STATUS: EXEMPT\nREPORTS TO: DIRECTOR, THIN FILM PROCESS DEVELOPMENT ENGINEERING\nSUMMARY:\nUnder the direction of the Director of Thin Film Process Engineering, the Thin Film Development Engineer is responsible for developing, monitoring, sustaining, and supporting complex TMR, CPP GMR, spin transfer oscillator film, or other low RA sensor processes for new and prototype products; designing and conducting complex wafer experiments, analyzing large volumes of data, and reporting the results; developing and driving the implementation of new practices or methodologies which reduce cost and improve operational efficiency; conducting root cause analysis and implementing corrective action; collaborating and leading initiatives with other groups or teams; developing and implementing advanced procedures for transitioning new products into the production line; and reviewing, updating, and maintaining documentation and process instructions. This position is located in Milpitas, California.\nESSENTIAL FUNCTIONS:\nDevelops, sustains, and supports complex thin film processes for new and prototype products; develops and implements novel approaches to improve and optimize TMR, CPP GMR, spin oscillator film, and low RA sensor processes\nDevelops and drives the implementation of novel practices or methodologies which reduce cost and improve yield, performance, and process capability\nConducts root cause analysis and implements corrective action if required\nDevelops and implements advanced processes or procedures for transitioning new products into the production line\nResolves process issues related to material selection; recommends corrective action\nInstructs operators and technicians on processes and procedures, including modifications to existing procedures\nLeads and manages programs or projects of various size or scope; communicates and updates key stakeholders regarding project milestones and status\nPartners with equipment and maintenance personnel in order to minimize tool down time and integrate new tools into the production line\nDesigns and conducts complex experiments, analyzes large volumes of data, and develops recommendations for improving the performance or reducing cost based on test results\nResponds to inquiries from other team members, managers, or departments\nAdheres to all safety policies and procedures as required\nPerforms other duties of a similar nature or level*\nMINIMUM QUALIFICATIONS:\nMaster’s degree in Physics, Materials Science, and/or equivalent relevant experience; PhD preferred\nThree years of hands’ on experience working in the magnetic recording head, hard disk drive, or semiconductor industry in a thin film process development engineering role\nStrong knowledge and experience using JMP, SPC, or similar software\nProficient in the use of Microsoft Office Applications\nKnowledge, Skills, and Abilities:\nStrong knowledge and experience of TMR, CPP GMR, spin transfer oscillator film, and low RA sensor processes\nStrong knowledge and experience of thin film manufacturing processes, practices, and techniques\nStrong knowledge of wafer fabrication processing techniques and tools\nStrong knowledge to design experiments, analyze results, and recommend corrective action in order to reduce scrap and improve yield\nStrong knowledge to use critical thinking to resolve issues, conduct root cause analysis, and make recommendations for process improvements\nKnowledge and ability to use Microsoft Office applications to create spreadsheets, Word documents, and presentations\nAble to communicate effectively, both verbally and in writing, with all levels of contractors, consultants, employees, and management\nAble to work productively and collaboratively with all levels of employees and management\nAble to comply with all safety policies and procedures\nDemonstrated organizational and time management skills\nDemonstrated problem-solving and trouble shooting skills\nFlexible and able to prioritize\nThe annual base salary for this full-time position is between $120,819.00-$177,675.00 + bonus target + benefits. Within the range the individual pay may differ depending on additional factors including job responsibilities, job related knowledge, skills, abilities, education, and experience. The annual base pay range shown is subject to change and may be modified periodically.\nWORKING CONDITIONS:\nThe Thin Film Process Development Engineer works primarily in an office environment from Monday to Friday. The schedule may be altered from time-to-time to meet business or operational needs; may travel from building-to-building as needed. May also work in a class 100 ESD sensitive wafer fab manufacturing facility; adheres to required safety and dress standards (wears a bunny suit). May be exposed to hazardous chemicals, fumes, or vapors and excessive noise from time-to-time while in the wafer manufacturing facility; stands and walks; performs various fine grasping movements, bends, and twists; operates a computer and enters information using a keyboard, operates a telephone, and other office equipment. May be required to push, pull, or lift up to 20 pounds.\nOther duties of a similar nature or level are duties that may be required, but may not be specifically listed in the job description or posting.\nTDK/Headway Technologies, Inc. provides equal employment opportunities (EEO) to all employees and applicants for employment without regard to race, color, religion, gender, national origin, age, disability, or genetics. Applicants requiring accommodation in order to complete the application process should contact the Headway Human Resources Department.","company":"Headway Technologies","rawCompany":"headway technologies","city":"Milpitas","state":"CA","isRemote":false,"isActive":false,"createdAt":"2026-04-12T21:28:50.166Z","occupations":[{"code":"17-2199.06","title":"Microsystems Engineers","slug":"microsystems-engineers"},{"code":"17-2131.00","title":"Materials Engineers","slug":"materials-engineers"},{"code":"51-9141.00","title":"Semiconductor Processing Technicians","slug":"semiconductor-processing-technicians"}],"industries":[{"code":"334413","title":"Semiconductor and Related Device Manufacturing","slug":"semiconductor-and-related-device-manufacturing"},{"code":"334419","title":"Other Electronic Component Manufacturing","slug":"other-electronic-component-manufacturing"},{"code":"541715","title":"Research and Development in the Physical, Engineering, and Life Sciences (except Nanotechnology and Biotechnology)","slug":"research-and-development-in-the-physical-engineering-and-life-sciences-except-nanotechnology-and-biotechnology"}],"jobPosting":{"@context":"https://schema.org","@type":"JobPosting","title":"Thin Film Process Development Engineer (Reader)","description":"TITLE: THIN FILM PROCESS DEVELOPMENT ENGINEER (READER)\nFLSA STATUS: EXEMPT\nREPORTS TO: DIRECTOR, THIN FILM PROCESS DEVELOPMENT ENGINEERING\nSUMMARY:\nUnder the direction of the Director of Thin Film Process Engineering, the Thin Film Development Engineer is responsible for developing, monitoring, sustaining, and supporting complex TMR, CPP GMR, spin transfer oscillator film, or other low RA sensor processes for new and prototype products; designing and conducting complex wafer experiments, analyzing large volumes of data, and reporting the results; developing and driving the implementation of new practices or methodologies which reduce cost and improve operational efficiency; conducting root cause analysis and implementing corrective action; collaborating and leading initiatives with other groups or teams; developing and implementing advanced procedures for transitioning new products into the production line; and reviewing, updating, and maintaining documentation and process instructions. This position is located in Milpitas, California.\nESSENTIAL FUNCTIONS:\nDevelops, sustains, and supports complex thin film processes for new and prototype products; develops and implements novel approaches to improve and optimize TMR, CPP GMR, spin oscillator film, and low RA sensor processes\nDevelops and drives the implementation of novel practices or methodologies which reduce cost and improve yield, performance, and process capability\nConducts root cause analysis and implements corrective action if required\nDevelops and implements advanced processes or procedures for transitioning new products into the production line\nResolves process issues related to material selection; recommends corrective action\nInstructs operators and technicians on processes and procedures, including modifications to existing procedures\nLeads and manages programs or projects of various size or scope; communicates and updates key stakeholders regarding project milestones and status\nPartners with equipment and maintenance personnel in order to minimize tool down time and integrate new tools into the production line\nDesigns and conducts complex experiments, analyzes large volumes of data, and develops recommendations for improving the performance or reducing cost based on test results\nResponds to inquiries from other team members, managers, or departments\nAdheres to all safety policies and procedures as required\nPerforms other duties of a similar nature or level*\nMINIMUM QUALIFICATIONS:\nMaster’s degree in Physics, Materials Science, and/or equivalent relevant experience; PhD preferred\nThree years of hands’ on experience working in the magnetic recording head, hard disk drive, or semiconductor industry in a thin film process development engineering role\nStrong knowledge and experience using JMP, SPC, or similar software\nProficient in the use of Microsoft Office Applications\nKnowledge, Skills, and Abilities:\nStrong knowledge and experience of TMR, CPP GMR, spin transfer oscillator film, and low RA sensor processes\nStrong knowledge and experience of thin film manufacturing processes, practices, and techniques\nStrong knowledge of wafer fabrication processing techniques and tools\nStrong knowledge to design experiments, analyze results, and recommend corrective action in order to reduce scrap and improve yield\nStrong knowledge to use critical thinking to resolve issues, conduct root cause analysis, and make recommendations for process improvements\nKnowledge and ability to use Microsoft Office applications to create spreadsheets, Word documents, and presentations\nAble to communicate effectively, both verbally and in writing, with all levels of contractors, consultants, employees, and management\nAble to work productively and collaboratively with all levels of employees and management\nAble to comply with all safety policies and procedures\nDemonstrated organizational and time management skills\nDemonstrated problem-solving and trouble shooting skills\nFlexible and able to prioritize\nThe annual base salary for this full-time position is between $120,819.00-$177,675.00 + bonus target + benefits. Within the range the individual pay may differ depending on additional factors including job responsibilities, job related knowledge, skills, abilities, education, and experience. The annual base pay range shown is subject to change and may be modified periodically.\nWORKING CONDITIONS:\nThe Thin Film Process Development Engineer works primarily in an office environment from Monday to Friday. The schedule may be altered from time-to-time to meet business or operational needs; may travel from building-to-building as needed. May also work in a class 100 ESD sensitive wafer fab manufacturing facility; adheres to required safety and dress standards (wears a bunny suit). May be exposed to hazardous chemicals, fumes, or vapors and excessive noise from time-to-time while in the wafer manufacturing facility; stands and walks; performs various fine grasping movements, bends, and twists; operates a computer and enters information using a keyboard, operates a telephone, and other office equipment. May be required to push, pull, or lift up to 20 pounds.\nOther duties of a similar nature or level are duties that may be required, but may not be specifically listed in the job description or posting.\nTDK/Headway Technologies, Inc. provides equal employment opportunities (EEO) to all employees and applicants for employment without regard to race, color, religion, gender, national origin, age, disability, or genetics. Applicants requiring accommodation in order to complete the application process should contact the Headway Human Resources Department.","datePosted":"2026-04-12T21:28:50.166Z","dateModified":"2026-04-12T21:28:50.166Z","hiringOrganization":{"@type":"Organization","name":"Headway Technologies","sameAs":"https://jobsearcher.com"},"jobLocation":{"@type":"Place","address":{"@type":"PostalAddress","addressLocality":"Milpitas","addressRegion":"CA","addressCountry":"US"}},"identifier":{"@type":"PropertyValue","name":"JobSearcher","value":"277ef6acecb462e3cd8cf69f"},"url":"https://jobsearcher.com/jobs/277ef6acecb462e3cd8cf69f"}}