{"schemaVersion":"jobsearcher.job.v1","id":"24ab4a5d542b383d4845cf44","url":"https://jobsearcher.com/jobs/24ab4a5d542b383d4845cf44","canonicalUrl":"https://jobsearcher.com/jobs/24ab4a5d542b383d4845cf44","title":"Substrate Process Engineer","description":"Summary:\nAtomica is a U.S.-based microfabrication foundry that builds advanced platforms for AI hardware, photonics, sensors, MEMS, and biotechnology devices. Atomica supports customers developing AI optical connectivity, AI optical source integration, photonic integration, thermal microstructures, physical AI sensors, MEMS optical control systems, and biotechnology microdevices with rapid prototyping and scalable production.\n\nWe are seeking a highly skilled and motivated Substrate Process Engineer with expertise in wafer bonding and high-precision alignment to join our MEMS fabrication team. This role focuses on developing and sustaining critical wafer-level bonding and alignment processes, such as anodic, fusion, direct, and adhesive bonding, with a strong emphasis on sub-micron to micron-level alignment accuracy required for MEMS device integration. The candidate will work closely with process engineering, integration, and R&D teams to enable reliable and scalable backend processes in a cleanroom manufacturing environment.\n\nKey Responsibilities\n\nDevelop and maintain wafer bonding processes (eutectic, thermocompression, direct, adhesive).\n\nWet etch processes (Si, oxide, metals) including rate and uniformity control.\n\nSupport electroplating processes (Au, Cu, Ni, NiFe, AuSn).\n\nSupport Dicing, CMP , wafer Grinding processes.\n\nImprove yield, reduce defects, and optimize process stability.\n\nPerform DOE, root cause analysis, and SPC monitoring.\n\nSupport equipment qualification and uptime.\n\nWork closely with R&D, production, and quality teams.\n\nQualifications\n\nB.S. or M.S. in Engineering (Materials, Chemical, Electrical, Mechanical, or related)\n\n3+ years experience in semiconductor or MEMS fabrication\n\nHands-on experience in at least two of the following:\n\nWafer bonding\n\nWet etching\n\nElectroplating\n\nCMP or wafer thinning\n\nDicing\n\nWhy work with us?\nAtomica is changing the world. Working at Atomica is truly a one-of-a-kind opportunity to impact groundbreaking technology while living in paradise.\n\nYour contributions to our MEMS technology will drive innovation, solve the great problems of our time and directly impact the lives of people across the globe.\n\nLife in Santa Barbara:\nWant to live in paradise? Life in Santa Barbara is just that. Atomica is sandwiched between the beautiful Santa Ynez mountains and the pristine Central California coastline. The weather? Absolutely gorgeous. No more shoveling snow or hiding from tornadoes!\n\nWithin 5-minutes from the office, you will find rich local culture, world class schools, airport for convenient travel, festivals, and excellent options to wine and dine.\n\nWe have had employees move from all over the country and say life has never been better!\n\nCompensation:\n$90,000-$140,000\n\n*Atomica encourages applications from candidates at all levels where pay will be based on experience.*\n\n#J-18808-Ljbffr","company":"Atomica","rawCompany":"atomica","city":"Santa Barbara","state":"CA","isRemote":false,"isActive":false,"createdAt":"2026-09-11T05:01:37.241Z","occupations":[{"code":"51-9141.00","title":"Semiconductor Processing Technicians","slug":"semiconductor-processing-technicians"},{"code":"17-2199.06","title":"Microsystems Engineers","slug":"microsystems-engineers"},{"code":"17-2131.00","title":"Materials Engineers","slug":"materials-engineers"}],"industries":[{"code":"334413","title":"Semiconductor and Related Device Manufacturing","slug":"semiconductor-and-related-device-manufacturing"},{"code":"541715","title":"Research and Development in the Physical, Engineering, and Life Sciences (except Nanotechnology and Biotechnology)","slug":"research-and-development-in-the-physical-engineering-and-life-sciences-except-nanotechnology-and-biotechnology"},{"code":"541713","title":"Research and Development in Nanotechnology","slug":"research-and-development-in-nanotechnology"}],"jobPosting":{"@context":"https://schema.org","@type":"JobPosting","title":"Substrate Process Engineer","description":"Summary:\nAtomica is a U.S.-based microfabrication foundry that builds advanced platforms for AI hardware, photonics, sensors, MEMS, and biotechnology devices. Atomica supports customers developing AI optical connectivity, AI optical source integration, photonic integration, thermal microstructures, physical AI sensors, MEMS optical control systems, and biotechnology microdevices with rapid prototyping and scalable production.\n\nWe are seeking a highly skilled and motivated Substrate Process Engineer with expertise in wafer bonding and high-precision alignment to join our MEMS fabrication team. This role focuses on developing and sustaining critical wafer-level bonding and alignment processes, such as anodic, fusion, direct, and adhesive bonding, with a strong emphasis on sub-micron to micron-level alignment accuracy required for MEMS device integration. The candidate will work closely with process engineering, integration, and R&D teams to enable reliable and scalable backend processes in a cleanroom manufacturing environment.\n\nKey Responsibilities\n\nDevelop and maintain wafer bonding processes (eutectic, thermocompression, direct, adhesive).\n\nWet etch processes (Si, oxide, metals) including rate and uniformity control.\n\nSupport electroplating processes (Au, Cu, Ni, NiFe, AuSn).\n\nSupport Dicing, CMP , wafer Grinding processes.\n\nImprove yield, reduce defects, and optimize process stability.\n\nPerform DOE, root cause analysis, and SPC monitoring.\n\nSupport equipment qualification and uptime.\n\nWork closely with R&D, production, and quality teams.\n\nQualifications\n\nB.S. or M.S. in Engineering (Materials, Chemical, Electrical, Mechanical, or related)\n\n3+ years experience in semiconductor or MEMS fabrication\n\nHands-on experience in at least two of the following:\n\nWafer bonding\n\nWet etching\n\nElectroplating\n\nCMP or wafer thinning\n\nDicing\n\nWhy work with us?\nAtomica is changing the world. Working at Atomica is truly a one-of-a-kind opportunity to impact groundbreaking technology while living in paradise.\n\nYour contributions to our MEMS technology will drive innovation, solve the great problems of our time and directly impact the lives of people across the globe.\n\nLife in Santa Barbara:\nWant to live in paradise? Life in Santa Barbara is just that. Atomica is sandwiched between the beautiful Santa Ynez mountains and the pristine Central California coastline. The weather? Absolutely gorgeous. No more shoveling snow or hiding from tornadoes!\n\nWithin 5-minutes from the office, you will find rich local culture, world class schools, airport for convenient travel, festivals, and excellent options to wine and dine.\n\nWe have had employees move from all over the country and say life has never been better!\n\nCompensation:\n$90,000-$140,000\n\n*Atomica encourages applications from candidates at all levels where pay will be based on experience.*\n\n#J-18808-Ljbffr","datePosted":"2026-09-11T05:01:37.241Z","dateModified":"2026-09-11T05:01:37.241Z","hiringOrganization":{"@type":"Organization","name":"Atomica","sameAs":"https://jobsearcher.com"},"jobLocation":{"@type":"Place","address":{"@type":"PostalAddress","addressLocality":"Santa Barbara","addressRegion":"CA","addressCountry":"US"}},"identifier":{"@type":"PropertyValue","name":"JobSearcher","value":"24ab4a5d542b383d4845cf44"},"url":"https://jobsearcher.com/jobs/24ab4a5d542b383d4845cf44"}}