{"schemaVersion":"jobsearcher.job.v1","id":"238aaca93c009dd32c75100b","url":"https://jobsearcher.com/jobs/238aaca93c009dd32c75100b","canonicalUrl":"https://jobsearcher.com/jobs/238aaca93c009dd32c75100b","title":"Module Integration Engineer","description":"Position Summary Seeking a senior individual contributor with hands‑on experience in module process integration for advanced Gate‑All‑Around (GAA) technologies. The Module Integration Engineering (MIE) team drives new technology transfer, establishes process integration routes, and enhances process margin, performance, yield, and reliability. In this role you will perform 2nm GAA source & drain (SD) module integration projects, working closely with Process Architect, Process Integration Engineering, Fab Engineering units, Device & SRAM integration, DFM, and manufacturing teams.\nResponsibilities Execute the Front End of Line (FEOL) module setup plan—particularly the source & drain (SD) module—with minimal supervision to meet aggressive qualification timelines.\nMonitor line performance, intervene on off‑target SPC excursions, and develop improvement plans that satisfy process capabilities.\nLead engineering projects that drive high‑volume manufacturing (HVM) product qualification, yield ramp‑up, and performance target achievement.\nLead Task Force Teams (TFTs) to resolve systematic yield, performance, or reliability challenges.\nPerform feasibility studies and create design of experiments (DOE) for performance and yield improvement throughout the product development cycle.\nProduce written reports and deliver oral presentations for internal management and external partners.\nQualifications Master’s or PhD degree in Electrical Engineering, Physics, Materials Science, or a closely related field.\nMinimum 8 years of experience on advanced node FinFET or GAA technology.\nFront End of Line (FEOL) module process integration engineering experience.\nStrong preference for GAA source & drain module integration engineering experience.\nDevice physics knowledge with hands‑on work in FinFET or GAA devices.\nKnowledge of unit processes such as lithography, dry/wet etch, CMP, diffusion, implant, thin‑film deposition, and metrology.\nExpertise in Design of Experiments (DOE) and experience with data‑analysis software (e.g., JMP, Spotfire).\nExperience leading projects and/or serving as a Task Force Team (TFT) lead.\nAbility to shift focus, change priorities, and meet deadlines on multiple priorities.\nInterpersonal skills with the ability to influence, motivate, and align diverse stakeholders.\nExcellent written and verbal communication skills.\nWilling to work and learn in a fast‑paced, cross‑functional, multicultural team environment.\nLocation & Compensation All positions at Samsung Austin Semiconductor require you to be onsite.\nBase salary range: $106,000 - $206,000. Total compensation may include a competitive benefits package and participation in incentive compensation programs based on performance.\nBenefits Medical, dental, and vision insurance\nLife insurance and 401(k) matching with immediate vesting\nOnsite café(s) and workout facilities\nPaid maternity and paternity leave\nPaid time off (PTO) + 2 personal holidays and 10 regular holidays\nWellness incentives\nEqual Opportunity Employment Samsung Electronics America, Inc. and its subsidiaries are committed to employing a diverse workforce and provide Equal Employment Opportunity for all individuals regardless of race, color, religion, gender, age, national origin, marital status, sexual orientation, gender identity, protected veteran status, genetic information, disability status, or any other characteristic protected by law.\n\n#J-18808-Ljbffr","company":"Samsung Electronics Peru","rawCompany":"samsung electronics peru","city":"Taylor","state":"TX","isRemote":false,"isActive":false,"createdAt":"2026-06-17T04:17:13.004Z","occupations":[{"code":"17-2199.06","title":"Microsystems Engineers","slug":"microsystems-engineers"},{"code":"51-9141.00","title":"Semiconductor Processing Technicians","slug":"semiconductor-processing-technicians"},{"code":"17-2072.00","title":"Electronics Engineers, Except Computer","slug":"electronics-engineers-except-computer"}],"industries":[{"code":"334413","title":"Semiconductor and Related Device Manufacturing","slug":"semiconductor-and-related-device-manufacturing"},{"code":"334419","title":"Other Electronic Component Manufacturing","slug":"other-electronic-component-manufacturing"},{"code":"334418","title":"Printed Circuit Assembly (Electronic Assembly) Manufacturing","slug":"printed-circuit-assembly-electronic-assembly-manufacturing"}],"jobPosting":{"@context":"https://schema.org","@type":"JobPosting","title":"Module Integration Engineer","description":"Position Summary Seeking a senior individual contributor with hands‑on experience in module process integration for advanced Gate‑All‑Around (GAA) technologies. The Module Integration Engineering (MIE) team drives new technology transfer, establishes process integration routes, and enhances process margin, performance, yield, and reliability. In this role you will perform 2nm GAA source & drain (SD) module integration projects, working closely with Process Architect, Process Integration Engineering, Fab Engineering units, Device & SRAM integration, DFM, and manufacturing teams.\nResponsibilities Execute the Front End of Line (FEOL) module setup plan—particularly the source & drain (SD) module—with minimal supervision to meet aggressive qualification timelines.\nMonitor line performance, intervene on off‑target SPC excursions, and develop improvement plans that satisfy process capabilities.\nLead engineering projects that drive high‑volume manufacturing (HVM) product qualification, yield ramp‑up, and performance target achievement.\nLead Task Force Teams (TFTs) to resolve systematic yield, performance, or reliability challenges.\nPerform feasibility studies and create design of experiments (DOE) for performance and yield improvement throughout the product development cycle.\nProduce written reports and deliver oral presentations for internal management and external partners.\nQualifications Master’s or PhD degree in Electrical Engineering, Physics, Materials Science, or a closely related field.\nMinimum 8 years of experience on advanced node FinFET or GAA technology.\nFront End of Line (FEOL) module process integration engineering experience.\nStrong preference for GAA source & drain module integration engineering experience.\nDevice physics knowledge with hands‑on work in FinFET or GAA devices.\nKnowledge of unit processes such as lithography, dry/wet etch, CMP, diffusion, implant, thin‑film deposition, and metrology.\nExpertise in Design of Experiments (DOE) and experience with data‑analysis software (e.g., JMP, Spotfire).\nExperience leading projects and/or serving as a Task Force Team (TFT) lead.\nAbility to shift focus, change priorities, and meet deadlines on multiple priorities.\nInterpersonal skills with the ability to influence, motivate, and align diverse stakeholders.\nExcellent written and verbal communication skills.\nWilling to work and learn in a fast‑paced, cross‑functional, multicultural team environment.\nLocation & Compensation All positions at Samsung Austin Semiconductor require you to be onsite.\nBase salary range: $106,000 - $206,000. Total compensation may include a competitive benefits package and participation in incentive compensation programs based on performance.\nBenefits Medical, dental, and vision insurance\nLife insurance and 401(k) matching with immediate vesting\nOnsite café(s) and workout facilities\nPaid maternity and paternity leave\nPaid time off (PTO) + 2 personal holidays and 10 regular holidays\nWellness incentives\nEqual Opportunity Employment Samsung Electronics America, Inc. and its subsidiaries are committed to employing a diverse workforce and provide Equal Employment Opportunity for all individuals regardless of race, color, religion, gender, age, national origin, marital status, sexual orientation, gender identity, protected veteran status, genetic information, disability status, or any other characteristic protected by law.\n\n#J-18808-Ljbffr","datePosted":"2026-06-17T04:17:13.004Z","dateModified":"2026-06-17T04:17:13.004Z","hiringOrganization":{"@type":"Organization","name":"Samsung Electronics Peru","sameAs":"https://jobsearcher.com"},"jobLocation":{"@type":"Place","address":{"@type":"PostalAddress","addressLocality":"Taylor","addressRegion":"TX","addressCountry":"US"}},"identifier":{"@type":"PropertyValue","name":"JobSearcher","value":"238aaca93c009dd32c75100b"},"url":"https://jobsearcher.com/jobs/238aaca93c009dd32c75100b"}}