{"schemaVersion":"jobsearcher.job.v1","id":"1cc2be4e2bf866a725670b94","url":"https://jobsearcher.com/jobs/1cc2be4e2bf866a725670b94","canonicalUrl":"https://jobsearcher.com/jobs/1cc2be4e2bf866a725670b94","title":"EMIB-T Substrate Program Integrator","description":"Overview\nIn this role you will lead EMIB-T substrate technology development and qualification, ensuring suppliers reach readiness for growing demand. You will steer technical enablement, manage milestones, and collaborate with cross-functional teams, suppliers, and platform partners. You’ll influence advanced packaging initiatives and drive alignment across global teams. The position offers a meaningful chance to shape cutting-edge packaging solutions in a high-impact environment.\n\nCompensation / Benefitscompetitive paystock bonuseshealth benefitsretirement plansvacationbonus programs\nResponsibilitieslead EMIB-T substrate technology development and qualification activitiesdrive readiness milestones and ensure supplier readiness for demandenable cross-functional engineering collaboration with suppliers and platform partnersmanage complex projects in TD/high-volume manufacturing settingssupport technology enablement and alignment across global teams\nKey requirementsBachelor's degree in Engineering with 6+ years of experience, or Master's with 4+ years, or PhD with 2+ yearsexperience managing complex TD/high-volume manufacturing projectsstrong foundation in advanced packaging, substrates, or semiconductor manufacturingleadership in supplier management or technology enablementability to drive alignment across global teamsfamiliarity with characterization techniques (X-ray, SEM, FTIR, EDX)experience with process flow development, FMEA, DOE, and problem-solving toolsfamiliarity with SPC for yield improvementleadershipability to thrive in high-ambiguity environmentscross-functional collaborationadvanced packaging technologiessubstrate/assembly manufacturing methodologiescharacterization techniques: X-ray, SEM, FTIR, EDX","company":"Intel","rawCompany":"intel","city":"Scottsdale","state":"AZ","isRemote":false,"isActive":true,"createdAt":"2026-09-15T03:56:12.441Z","occupations":[{"code":"51-9141.00","title":"Semiconductor Processing Technicians","slug":"semiconductor-processing-technicians"},{"code":"17-2131.00","title":"Materials Engineers","slug":"materials-engineers"},{"code":"11-3071.04","title":"Supply Chain Managers","slug":"supply-chain-managers"}],"industries":[{"code":"334413","title":"Semiconductor and Related Device Manufacturing","slug":"semiconductor-and-related-device-manufacturing"},{"code":"333242","title":"Semiconductor Machinery Manufacturing","slug":"semiconductor-machinery-manufacturing"},{"code":"334419","title":"Other Electronic Component Manufacturing","slug":"other-electronic-component-manufacturing"}],"jobPosting":{"@context":"https://schema.org","@type":"JobPosting","title":"EMIB-T Substrate Program Integrator","description":"Overview\nIn this role you will lead EMIB-T substrate technology development and qualification, ensuring suppliers reach readiness for growing demand. You will steer technical enablement, manage milestones, and collaborate with cross-functional teams, suppliers, and platform partners. You’ll influence advanced packaging initiatives and drive alignment across global teams. The position offers a meaningful chance to shape cutting-edge packaging solutions in a high-impact environment.\n\nCompensation / Benefitscompetitive paystock bonuseshealth benefitsretirement plansvacationbonus programs\nResponsibilitieslead EMIB-T substrate technology development and qualification activitiesdrive readiness milestones and ensure supplier readiness for demandenable cross-functional engineering collaboration with suppliers and platform partnersmanage complex projects in TD/high-volume manufacturing settingssupport technology enablement and alignment across global teams\nKey requirementsBachelor's degree in Engineering with 6+ years of experience, or Master's with 4+ years, or PhD with 2+ yearsexperience managing complex TD/high-volume manufacturing projectsstrong foundation in advanced packaging, substrates, or semiconductor manufacturingleadership in supplier management or technology enablementability to drive alignment across global teamsfamiliarity with characterization techniques (X-ray, SEM, FTIR, EDX)experience with process flow development, FMEA, DOE, and problem-solving toolsfamiliarity with SPC for yield improvementleadershipability to thrive in high-ambiguity environmentscross-functional collaborationadvanced packaging technologiessubstrate/assembly manufacturing methodologiescharacterization techniques: X-ray, SEM, FTIR, EDX","datePosted":"2026-09-15T03:56:12.441Z","dateModified":"2026-09-15T03:56:12.441Z","hiringOrganization":{"@type":"Organization","name":"Intel","sameAs":"https://jobsearcher.com"},"jobLocation":{"@type":"Place","address":{"@type":"PostalAddress","addressLocality":"Scottsdale","addressRegion":"AZ","addressCountry":"US"}},"identifier":{"@type":"PropertyValue","name":"JobSearcher","value":"1cc2be4e2bf866a725670b94"},"url":"https://jobsearcher.com/jobs/1cc2be4e2bf866a725670b94"}}