{"schemaVersion":"jobsearcher.job.v1","id":"0f63be4011791b4c7ffa8928","url":"https://jobsearcher.com/jobs/0f63be4011791b4c7ffa8928","canonicalUrl":"https://jobsearcher.com/jobs/0f63be4011791b4c7ffa8928","title":"Printed Circuit Board Design Engineer","description":"Title – PCB layout EngineerLocation – RemoteThe ideal candidate should have strong relevant and recent technical and hands-on backgroundand be able is hit the ground running as an individual contributorContribute to, or lead, PCB and package substrate layout development for leading-edge optical communication products.Ensure compliance with IPC standards, company design practices, and fabrication capabilities.Collaborate with electrical, mechanical, thermal, signal-integrity, power-integrity, and manufacturing teams.Work with PCB fabricators, and substrate vendors to close DFMs.Minimum RequirementsBachelor’s degree or equivalent certifications with a minimum of 10+ years of relevant industry experience in PCB board and/or package substrate layout engineering.Expert-level proficiency with Cadence Allegro PCB design toolsStrong demonstrated working experience of complex high-density, high-speed PCB and substrate designs using advanced HDI, stacked micro-via, sequential lamination, and fine-pitch BGA technologies.Hands-on experience with complex multilayer high-density organic substrates, fine-pitch BGAs, and advanced component packages.Working understanding of transmission line layout geometries and rules (micro strip, strip line, CPW, etc.)Demonstrated experience in layout of compact low voltage and high current multiphase DC-DC power converters for state-of-the-art processors and GPUsStrong understanding of PCB fabrication, assembly processes, DFM, and manufacturing tolerances.Demonstrated success delivering high-volume, high-reliability communication products under aggressive schedules.","company":"Programmingcom","rawCompany":"programmingcom","city":"Denver","state":"CO","isRemote":false,"isActive":false,"createdAt":"2026-10-08T07:52:45.759Z","occupations":[{"code":"17-2072.00","title":"Electronics Engineers, Except Computer","slug":"electronics-engineers-except-computer"},{"code":"17-2071.00","title":"Electrical Engineers","slug":"electrical-engineers"},{"code":"17-3012.00","title":"Electrical and Electronics Drafters","slug":"electrical-and-electronics-drafters"}],"industries":[{"code":"334418","title":"Printed Circuit Assembly (Electronic Assembly) Manufacturing","slug":"printed-circuit-assembly-electronic-assembly-manufacturing"},{"code":"334419","title":"Other Electronic Component Manufacturing","slug":"other-electronic-component-manufacturing"},{"code":"334412","title":"Bare Printed Circuit Board Manufacturing","slug":"bare-printed-circuit-board-manufacturing"}],"jobPosting":{"@context":"https://schema.org","@type":"JobPosting","title":"Printed Circuit Board Design Engineer","description":"Title – PCB layout EngineerLocation – RemoteThe ideal candidate should have strong relevant and recent technical and hands-on backgroundand be able is hit the ground running as an individual contributorContribute to, or lead, PCB and package substrate layout development for leading-edge optical communication products.Ensure compliance with IPC standards, company design practices, and fabrication capabilities.Collaborate with electrical, mechanical, thermal, signal-integrity, power-integrity, and manufacturing teams.Work with PCB fabricators, and substrate vendors to close DFMs.Minimum RequirementsBachelor’s degree or equivalent certifications with a minimum of 10+ years of relevant industry experience in PCB board and/or package substrate layout engineering.Expert-level proficiency with Cadence Allegro PCB design toolsStrong demonstrated working experience of complex high-density, high-speed PCB and substrate designs using advanced HDI, stacked micro-via, sequential lamination, and fine-pitch BGA technologies.Hands-on experience with complex multilayer high-density organic substrates, fine-pitch BGAs, and advanced component packages.Working understanding of transmission line layout geometries and rules (micro strip, strip line, CPW, etc.)Demonstrated experience in layout of compact low voltage and high current multiphase DC-DC power converters for state-of-the-art processors and GPUsStrong understanding of PCB fabrication, assembly processes, DFM, and manufacturing tolerances.Demonstrated success delivering high-volume, high-reliability communication products under aggressive schedules.","datePosted":"2026-10-08T07:52:45.759Z","dateModified":"2026-10-08T07:52:45.759Z","hiringOrganization":{"@type":"Organization","name":"Programmingcom","sameAs":"https://jobsearcher.com"},"jobLocation":{"@type":"Place","address":{"@type":"PostalAddress","addressLocality":"Denver","addressRegion":"CO","addressCountry":"US"}},"identifier":{"@type":"PropertyValue","name":"JobSearcher","value":"0f63be4011791b4c7ffa8928"},"url":"https://jobsearcher.com/jobs/0f63be4011791b4c7ffa8928"}}