{"schemaVersion":"jobsearcher.job.v1","id":"0ca42a7d896082f60cc780ab","url":"https://jobsearcher.com/jobs/0ca42a7d896082f60cc780ab","canonicalUrl":"https://jobsearcher.com/jobs/0ca42a7d896082f60cc780ab","title":"Module Development Engineer (Hiring Immediately)","description":"Job Description Drives technology development and enablement for both high volume manufacturing and future technology, provides process integration and equipment solutions, and performs feasibility studies to meet desired device specificationsLeads design and development of technically sophisticated manufacturing processes and/or repair reverse engineering including material selection, parameter optimization, equipment metrology, and system design to enable new product designs and functional requirementsPerforms pathfinding activities in support of process and hardware development enabling manufacturing of innovative device architectures, and develops roadmaps for technologies enabling future roadmapRecommends and implements modifications for operating equipment to improve production efficiency, manufacturing techniques, and optimizing production output for existing productsPartners with key equipment and materials suppliers to develop and implement enabling elements of the technologyPerforms process technology feasibility studies through theoretical simulations and/or practical engineering methodsRemains updated on relevant industrial process and material manufacturing technical trends and develops view of inherent future Intel process technology needs to push industry forward by partnering with vendor ecosystem to build cost sensitive roadmap Qualifications Minimum qualifications are required to be initially considered for this position. Preferred qualifications are in addition to the minimum requirements and are considered a plus factor in identifying top candidates. Requirements listed would be obtained through a combination of industry relevant job experience, internship experiences and or schoolwork/classes/research.Minimum Qualifications:PhD in Chemical Engineering, Materials Science, Physics, Electrical Engineering, or a semiconductor related STEM field with 4+ years of relevant experienceORMaster's degree in Chemical Engineering, Materials Science, Physics, Electrical Engineering, or a semiconductor related STEM field with 6+ years of relevant experienceORBachelor's degree in Chemical Engineering, Materials Science, Physics, Electrical Engineering, or a semiconductor related STEM field with 9+ years of relevant experienceRelevant recent experience includes, but is not limited to:Hands-on experience in dry etch semiconductor manufacturing, including ownership of complex process development and optimization in a foundry or high volume manufacturing environmentStrong command of plasma etch fundamentals, including plasma generation, plasma-surface interactions, selectivity, profile control, and defect mechanismsDemonstrated record of delivering dry etch process solutions that improved yield, reliability, performance, or manufacturability for advanced technology nodesProven ability to lead technical problem solving across projects or sub modules, influencing peers and stakeholders without formal people management responsibilityExpertise in statistical analysis and DOE methodologies, using tools such as JMP, Python, or MATLAB to drive data based decisionsExperience working with and troubleshooting advanced semiconductor manufacturing equipment in a cleanroom environmentPreferred Qualifications:5+ years of direct experience developing and deploying dry etch processes for advanced logic or foundry technologies, including technology node transitions or major process changesExperience with advanced dry etch technologies such as:ICP / CCP plasma etch o High aspect ratio etch (HARC) o Atomic Layer Etch (ALE) o Radical and Vapor phase isotropic etching o Ash and surface treatments o EUV patterned layer etch integrationDemonstrated impact on cross module or integration level challenges, such as pattern fidelity, CD control, defectivity, variability reduction, or process window expansionStrong understanding of advanced device architectures (e.g., FinFET, GAA, nanosheet) and their etch integration requirementsExperience with materials and device characterization techniques, including SEM, TEM, CD SEM, AFM, XPS, or electrical correlationAbility to define technical approaches, de risk options, and guide less senior engineers through complex problem solvingTrack record of effective collaboration with integration, lithography, device, yield, and equipment partner teams to deliver robust manufacturing solutionsEvidence of broader technical influence, such as internal technology disclosures, patents, publications, or recognized subject matter expertise within the organizationFor information on Intel's immigration sponsorship guidelines, please see Intel U.S. Immigration Sponsorship Information Other Locations US, AZ, Phoenix; US, CA, Santa Clara Posting Statement All qualified applicants will receive consideration for employment without regard to race, color, religion, religious creed, sex, national origin, ancestry, age, physical or mental disability, medical condition, genetic information, military and veteran status, marital status, pregnancy, gender, gender expression, gender identity, sexual orientation, or any other characteristic protected by local law, regulation, or ordinance. Benefits We offer a total compensation package that ranks among the best in the industry. It consists of competitive pay, stock, bonuses, as well as, benefit programs which include health, retirement, and vacation. Find more information about all of our Amazing Benefits here. Annual Salary Range for jobs which could be performed in the US $172,200.00-$243,000.00 *Salary range dependent on a number of factors including location and experience Working Model This role will require an on-site presence. * Job posting details (such as work model, location or time type) are subject to change.","company":"Intel","rawCompany":"intel","city":"Phoenix","state":"AZ","isRemote":false,"isActive":false,"createdAt":"2026-07-05T02:44:28.344Z","occupations":[{"code":"17-2061.00","title":"Computer Hardware Engineers","slug":"computer-hardware-engineers"},{"code":"51-9141.00","title":"Semiconductor Processing Technicians","slug":"semiconductor-processing-technicians"},{"code":"17-2131.00","title":"Materials Engineers","slug":"materials-engineers"}],"industries":[{"code":"334413","title":"Semiconductor and Related Device Manufacturing","slug":"semiconductor-and-related-device-manufacturing"},{"code":"541715","title":"Research and Development in the Physical, Engineering, and Life Sciences (except Nanotechnology and Biotechnology)","slug":"research-and-development-in-the-physical-engineering-and-life-sciences-except-nanotechnology-and-biotechnology"},{"code":"334111","title":"Electronic Computer Manufacturing","slug":"electronic-computer-manufacturing"}],"jobPosting":{"@context":"https://schema.org","@type":"JobPosting","title":"Module Development Engineer (Hiring Immediately)","description":"Job Description Drives technology development and enablement for both high volume manufacturing and future technology, provides process integration and equipment solutions, and performs feasibility studies to meet desired device specificationsLeads design and development of technically sophisticated manufacturing processes and/or repair reverse engineering including material selection, parameter optimization, equipment metrology, and system design to enable new product designs and functional requirementsPerforms pathfinding activities in support of process and hardware development enabling manufacturing of innovative device architectures, and develops roadmaps for technologies enabling future roadmapRecommends and implements modifications for operating equipment to improve production efficiency, manufacturing techniques, and optimizing production output for existing productsPartners with key equipment and materials suppliers to develop and implement enabling elements of the technologyPerforms process technology feasibility studies through theoretical simulations and/or practical engineering methodsRemains updated on relevant industrial process and material manufacturing technical trends and develops view of inherent future Intel process technology needs to push industry forward by partnering with vendor ecosystem to build cost sensitive roadmap Qualifications Minimum qualifications are required to be initially considered for this position. Preferred qualifications are in addition to the minimum requirements and are considered a plus factor in identifying top candidates. Requirements listed would be obtained through a combination of industry relevant job experience, internship experiences and or schoolwork/classes/research.Minimum Qualifications:PhD in Chemical Engineering, Materials Science, Physics, Electrical Engineering, or a semiconductor related STEM field with 4+ years of relevant experienceORMaster's degree in Chemical Engineering, Materials Science, Physics, Electrical Engineering, or a semiconductor related STEM field with 6+ years of relevant experienceORBachelor's degree in Chemical Engineering, Materials Science, Physics, Electrical Engineering, or a semiconductor related STEM field with 9+ years of relevant experienceRelevant recent experience includes, but is not limited to:Hands-on experience in dry etch semiconductor manufacturing, including ownership of complex process development and optimization in a foundry or high volume manufacturing environmentStrong command of plasma etch fundamentals, including plasma generation, plasma-surface interactions, selectivity, profile control, and defect mechanismsDemonstrated record of delivering dry etch process solutions that improved yield, reliability, performance, or manufacturability for advanced technology nodesProven ability to lead technical problem solving across projects or sub modules, influencing peers and stakeholders without formal people management responsibilityExpertise in statistical analysis and DOE methodologies, using tools such as JMP, Python, or MATLAB to drive data based decisionsExperience working with and troubleshooting advanced semiconductor manufacturing equipment in a cleanroom environmentPreferred Qualifications:5+ years of direct experience developing and deploying dry etch processes for advanced logic or foundry technologies, including technology node transitions or major process changesExperience with advanced dry etch technologies such as:ICP / CCP plasma etch o High aspect ratio etch (HARC) o Atomic Layer Etch (ALE) o Radical and Vapor phase isotropic etching o Ash and surface treatments o EUV patterned layer etch integrationDemonstrated impact on cross module or integration level challenges, such as pattern fidelity, CD control, defectivity, variability reduction, or process window expansionStrong understanding of advanced device architectures (e.g., FinFET, GAA, nanosheet) and their etch integration requirementsExperience with materials and device characterization techniques, including SEM, TEM, CD SEM, AFM, XPS, or electrical correlationAbility to define technical approaches, de risk options, and guide less senior engineers through complex problem solvingTrack record of effective collaboration with integration, lithography, device, yield, and equipment partner teams to deliver robust manufacturing solutionsEvidence of broader technical influence, such as internal technology disclosures, patents, publications, or recognized subject matter expertise within the organizationFor information on Intel's immigration sponsorship guidelines, please see Intel U.S. Immigration Sponsorship Information Other Locations US, AZ, Phoenix; US, CA, Santa Clara Posting Statement All qualified applicants will receive consideration for employment without regard to race, color, religion, religious creed, sex, national origin, ancestry, age, physical or mental disability, medical condition, genetic information, military and veteran status, marital status, pregnancy, gender, gender expression, gender identity, sexual orientation, or any other characteristic protected by local law, regulation, or ordinance. Benefits We offer a total compensation package that ranks among the best in the industry. It consists of competitive pay, stock, bonuses, as well as, benefit programs which include health, retirement, and vacation. Find more information about all of our Amazing Benefits here. Annual Salary Range for jobs which could be performed in the US $172,200.00-$243,000.00 *Salary range dependent on a number of factors including location and experience Working Model This role will require an on-site presence. * Job posting details (such as work model, location or time type) are subject to change.","datePosted":"2026-07-05T02:44:28.344Z","dateModified":"2026-07-05T02:44:28.344Z","hiringOrganization":{"@type":"Organization","name":"Intel","sameAs":"https://jobsearcher.com"},"jobLocation":{"@type":"Place","address":{"@type":"PostalAddress","addressLocality":"Phoenix","addressRegion":"AZ","addressCountry":"US"}},"identifier":{"@type":"PropertyValue","name":"JobSearcher","value":"0ca42a7d896082f60cc780ab"},"url":"https://jobsearcher.com/jobs/0ca42a7d896082f60cc780ab"}}