{"schemaVersion":"jobsearcher.job.v1","id":"0c27ab6730239dc6f337c6dd","url":"https://jobsearcher.com/jobs/0c27ab6730239dc6f337c6dd","canonicalUrl":"https://jobsearcher.com/jobs/0c27ab6730239dc6f337c6dd","title":"Development Engineer-Simulation Expert","description":"Summary:\nThis role is responsible for driving the thermal design and optimization of high‑performance computing (HPC) systems using advanced Multiphysics simulations and CAD‑based design support. The role focuses on thermal and CFD modeling to evaluate new concepts, materials, cooling architectures, and CAD models for high‑power‑density applications. By translating simulation insights into robust design recommendations, this position helps enable next‑generation HPC solutions. is responsible for assisting in the development of new products and manufacturing processes. Establishing a sound technical basis for these developments, this role will work closely with internal team members to understand material and manufacturing constraints. With a strong detail‑orientation, this position will help document development processes, perform experimental processes, and track results.\n\nEssential Functions:\n\nPerform advanced Multiphysics simulations with a strong emphasis on thermal and CFD analyses for the thermal design of HPC systems and components.\n\nDevelop and optimize cooling concepts for high‑power‑density and high‑performance computing applications, including cold plates and system‑level thermal architectures.\n\nEvaluate new product concepts, materials, and processes using simulation to guide thermal design decisions.\n\nCreate CAD models to support simulation setup, design evaluation, and optimization of thermal solutions.\n\nApply simulation‑based Design of Experiments (DoE) to assess sensitivities, tradeoffs, and robustness of thermal designs.\n\nSupport the development and refinement of thermal design rules and operating limits for HPC applications.\n\nCollaborate closely with cross‑functional teams (R&D, engineering, sales, marketing) to translate customer and system requirements into effective thermal solutions.\n\nProvide simulation expertise during technical discussions with customers to understand performance requirements and application challenges.\n\nMonitor relevant technologies, tools, and market trends related to HPC cooling, thermal management, and Multiphysics simulation.\n\nReview and evaluate external patents and publications related to thermal design, simulation methods, and cooling technologies.\n\nSupport development projects through clear technical documentation and regular status updates.\n\nQualifications:\n\nBachelor’s, Master’s, or PhD in Mechanical Engineering, Physics, Materials Science, or a related engineering discipline.\n\n3+ years of professional experience in Multiphysics simulation, ideally gained in an industrial environment.\n\nStrong hands‑on experience with Multiphysics simulations, with a clear focus on thermal and CFD modeling.\n\nExperience applying simulation methods to thermal design of complex systems, preferably in HPC or high‑power‑density environments.\n\nExperience using DoE or structured experimentation methods to evaluate and optimize thermal concepts is preferred.\n\nExperience creating CAD models and applying strong CAD skills in support of simulation‑driven design and optimization.\n\nDeep understanding of heat transfer, fluid dynamics, and thermal management principles.\n\nAbility to translate simulation results into practical, design‑relevant recommendations.\n\nFamiliarity with HPC system architecture and cooling challenges is highly desirable.\n\nExperience in power electronics or related applications is a plus.\n\nKnowledge of Six Sigma or structured problem‑solving methods is an advantage.\n\n#J-18808-Ljbffr","company":"Rogers","rawCompany":"rogers","city":"Royal","state":"AR","isRemote":false,"isActive":true,"createdAt":"2026-07-05T03:18:48.000Z","occupations":[{"code":"17-2141.00","title":"Mechanical Engineers","slug":"mechanical-engineers"},{"code":"17-2199.00","title":"Engineers, All Other","slug":"engineers-all-other"},{"code":"17-2061.00","title":"Computer Hardware Engineers","slug":"computer-hardware-engineers"}],"industries":[{"code":"541715","title":"Research and Development in the Physical, Engineering, and Life Sciences (except Nanotechnology and Biotechnology)","slug":"research-and-development-in-the-physical-engineering-and-life-sciences-except-nanotechnology-and-biotechnology"},{"code":"541330","title":"Engineering Services","slug":"engineering-services"},{"code":"333415","title":"Air-Conditioning and Warm Air Heating Equipment and Commercial and Industrial Refrigeration Equipment Manufacturing","slug":"air-conditioning-and-warm-air-heating-equipment-and-commercial-and-industrial-refrigeration-equipment-manufacturing"}],"jobPosting":{"@context":"https://schema.org","@type":"JobPosting","title":"Development Engineer-Simulation Expert","description":"Summary:\nThis role is responsible for driving the thermal design and optimization of high‑performance computing (HPC) systems using advanced Multiphysics simulations and CAD‑based design support. The role focuses on thermal and CFD modeling to evaluate new concepts, materials, cooling architectures, and CAD models for high‑power‑density applications. By translating simulation insights into robust design recommendations, this position helps enable next‑generation HPC solutions. is responsible for assisting in the development of new products and manufacturing processes. Establishing a sound technical basis for these developments, this role will work closely with internal team members to understand material and manufacturing constraints. With a strong detail‑orientation, this position will help document development processes, perform experimental processes, and track results.\n\nEssential Functions:\n\nPerform advanced Multiphysics simulations with a strong emphasis on thermal and CFD analyses for the thermal design of HPC systems and components.\n\nDevelop and optimize cooling concepts for high‑power‑density and high‑performance computing applications, including cold plates and system‑level thermal architectures.\n\nEvaluate new product concepts, materials, and processes using simulation to guide thermal design decisions.\n\nCreate CAD models to support simulation setup, design evaluation, and optimization of thermal solutions.\n\nApply simulation‑based Design of Experiments (DoE) to assess sensitivities, tradeoffs, and robustness of thermal designs.\n\nSupport the development and refinement of thermal design rules and operating limits for HPC applications.\n\nCollaborate closely with cross‑functional teams (R&D, engineering, sales, marketing) to translate customer and system requirements into effective thermal solutions.\n\nProvide simulation expertise during technical discussions with customers to understand performance requirements and application challenges.\n\nMonitor relevant technologies, tools, and market trends related to HPC cooling, thermal management, and Multiphysics simulation.\n\nReview and evaluate external patents and publications related to thermal design, simulation methods, and cooling technologies.\n\nSupport development projects through clear technical documentation and regular status updates.\n\nQualifications:\n\nBachelor’s, Master’s, or PhD in Mechanical Engineering, Physics, Materials Science, or a related engineering discipline.\n\n3+ years of professional experience in Multiphysics simulation, ideally gained in an industrial environment.\n\nStrong hands‑on experience with Multiphysics simulations, with a clear focus on thermal and CFD modeling.\n\nExperience applying simulation methods to thermal design of complex systems, preferably in HPC or high‑power‑density environments.\n\nExperience using DoE or structured experimentation methods to evaluate and optimize thermal concepts is preferred.\n\nExperience creating CAD models and applying strong CAD skills in support of simulation‑driven design and optimization.\n\nDeep understanding of heat transfer, fluid dynamics, and thermal management principles.\n\nAbility to translate simulation results into practical, design‑relevant recommendations.\n\nFamiliarity with HPC system architecture and cooling challenges is highly desirable.\n\nExperience in power electronics or related applications is a plus.\n\nKnowledge of Six Sigma or structured problem‑solving methods is an advantage.\n\n#J-18808-Ljbffr","datePosted":"2026-07-05T03:18:48.000Z","dateModified":"2026-07-05T03:18:48.000Z","hiringOrganization":{"@type":"Organization","name":"Rogers","sameAs":"https://jobsearcher.com"},"jobLocation":{"@type":"Place","address":{"@type":"PostalAddress","addressLocality":"Royal","addressRegion":"AR","addressCountry":"US"}},"identifier":{"@type":"PropertyValue","name":"JobSearcher","value":"0c27ab6730239dc6f337c6dd"},"url":"https://jobsearcher.com/jobs/0c27ab6730239dc6f337c6dd"}}