{"schemaVersion":"jobsearcher.job.v1","id":"0b3f98fe0468e57855bd4a9e","url":"https://jobsearcher.com/jobs/0b3f98fe0468e57855bd4a9e","canonicalUrl":"https://jobsearcher.com/jobs/0b3f98fe0468e57855bd4a9e","title":"Packaging Module Engineer","description":"Role Overview As a Packaging Module Engineer, you will shape Intel's advanced packaging solutions that directly impact the delivery, performance, and sustainability of cutting-edge products. You will design and develop innovative packaging solutions that ensure secure transport and optimal performance of Intel products globally.\nKey Responsibilities Design, develop, and qualify packaging solutions and materials that meet product and regulatory requirements.\nLead packaging development processes, including artwork creation, concepts, prototypes, qualification testing, and specification documentation.\nCollaborate with manufacturing, logistics, regulatory, and supply-chain partners to ensure packaging solutions meet operational needs.\nIdentify and implement cost-saving, waste-reduction, and efficiency improvement measures for packaging processes.\nConduct risk analysis to ensure packaging solutions comply with regulations and align with Intel's quality standards.\nConsult with cross-organizational teams on branding, marketing, SKUs, labeling, and bills of material requirements for shipments into Intel's distribution channel.\nEvaluate and qualify vendors to ensure high-quality packaging manufacturing startup and scalability.\nBenchmark packaging designs and processes against industry standards to maintain a competitive edge.\nDocument and maintain technical specifications for packaging solutions to ensure consistency and clarity.\nBehavioral Traits Demonstrated problem-solving skills in packaging development or manufacturing.\nEffective communication skills to collaborate with cross-organizational teams, external vendors, and customers.\nMinimum Qualifications and Experience Master's degree in Engineering, Physics, Chemistry, or a related STEM field with 1+ years of educational or work experience, or a PhD in the same fields with 6+ months of educational or work experience.\nExperience in product packaging assembly processes and production methodologies.\nStatistical process control (SPC) principles and design of experiments (DOE) techniques.\nAnalytical skills with proficiency in data analysis and risk assessment methods.\nDesign for manufacturing (DFM) practices and packaging test criteria.\nPreferred Qualifications and Experience Experience with Surface Mount Technologies, solder joint formation/quality/reliability, and package certification methodologies.\nExperience leading technical teams, influencing stakeholders, and managing resources and timelines in a matrixed environment.\nFamiliarity with semiconductor device fabrication processes and packaging process flows.\nA track record of delivering results in time-critical technical projects involving innovation and strategic planning.\nApply problem-solving techniques and fundamental engineering concepts to create novel, efficient solutions.\nPassion for engineering excellence and sustainability.\nJob Details Job Type: College Graduate\nShift: Shift 1 (United States of America)\nPrimary Location: Phoenix, Arizona, USA\nWork Model: On-site presence\nBenefits Competitive pay, stock bonuses, and benefit programs including health, retirement, and vacation.\nAnnual salary range: $133,800.00-$188,890.00 USD.\nEEO Statement All qualified applicants will receive consideration for employment without regard to race, color, religion, religious creed, sex, national origin, ancestry, age, physical or mental disability, medical condition, genetic information, military and veteran status, marital status, pregnancy, gender, gender expression, gender identity, sexual orientation, or any other characteristic protected by local law, regulation, or ordinance.\n\n#J-18808-Ljbffr","company":"Intel","rawCompany":"intel","city":"Chandler","state":"AZ","isRemote":false,"isActive":false,"createdAt":"2026-06-17T04:12:00.752Z","occupations":[{"code":"51-9111.00","title":"Packaging and Filling Machine Operators and Tenders","slug":"packaging-and-filling-machine-operators-and-tenders"},{"code":"17-2199.00","title":"Engineers, All Other","slug":"engineers-all-other"},{"code":"53-7064.00","title":"Packers and Packagers, Hand","slug":"packers-and-packagers-hand"}],"industries":[{"code":"334413","title":"Semiconductor and Related Device Manufacturing","slug":"semiconductor-and-related-device-manufacturing"},{"code":"334111","title":"Electronic Computer Manufacturing","slug":"electronic-computer-manufacturing"},{"code":"334418","title":"Printed Circuit Assembly (Electronic Assembly) Manufacturing","slug":"printed-circuit-assembly-electronic-assembly-manufacturing"}],"jobPosting":{"@context":"https://schema.org","@type":"JobPosting","title":"Packaging Module Engineer","description":"Role Overview As a Packaging Module Engineer, you will shape Intel's advanced packaging solutions that directly impact the delivery, performance, and sustainability of cutting-edge products. You will design and develop innovative packaging solutions that ensure secure transport and optimal performance of Intel products globally.\nKey Responsibilities Design, develop, and qualify packaging solutions and materials that meet product and regulatory requirements.\nLead packaging development processes, including artwork creation, concepts, prototypes, qualification testing, and specification documentation.\nCollaborate with manufacturing, logistics, regulatory, and supply-chain partners to ensure packaging solutions meet operational needs.\nIdentify and implement cost-saving, waste-reduction, and efficiency improvement measures for packaging processes.\nConduct risk analysis to ensure packaging solutions comply with regulations and align with Intel's quality standards.\nConsult with cross-organizational teams on branding, marketing, SKUs, labeling, and bills of material requirements for shipments into Intel's distribution channel.\nEvaluate and qualify vendors to ensure high-quality packaging manufacturing startup and scalability.\nBenchmark packaging designs and processes against industry standards to maintain a competitive edge.\nDocument and maintain technical specifications for packaging solutions to ensure consistency and clarity.\nBehavioral Traits Demonstrated problem-solving skills in packaging development or manufacturing.\nEffective communication skills to collaborate with cross-organizational teams, external vendors, and customers.\nMinimum Qualifications and Experience Master's degree in Engineering, Physics, Chemistry, or a related STEM field with 1+ years of educational or work experience, or a PhD in the same fields with 6+ months of educational or work experience.\nExperience in product packaging assembly processes and production methodologies.\nStatistical process control (SPC) principles and design of experiments (DOE) techniques.\nAnalytical skills with proficiency in data analysis and risk assessment methods.\nDesign for manufacturing (DFM) practices and packaging test criteria.\nPreferred Qualifications and Experience Experience with Surface Mount Technologies, solder joint formation/quality/reliability, and package certification methodologies.\nExperience leading technical teams, influencing stakeholders, and managing resources and timelines in a matrixed environment.\nFamiliarity with semiconductor device fabrication processes and packaging process flows.\nA track record of delivering results in time-critical technical projects involving innovation and strategic planning.\nApply problem-solving techniques and fundamental engineering concepts to create novel, efficient solutions.\nPassion for engineering excellence and sustainability.\nJob Details Job Type: College Graduate\nShift: Shift 1 (United States of America)\nPrimary Location: Phoenix, Arizona, USA\nWork Model: On-site presence\nBenefits Competitive pay, stock bonuses, and benefit programs including health, retirement, and vacation.\nAnnual salary range: $133,800.00-$188,890.00 USD.\nEEO Statement All qualified applicants will receive consideration for employment without regard to race, color, religion, religious creed, sex, national origin, ancestry, age, physical or mental disability, medical condition, genetic information, military and veteran status, marital status, pregnancy, gender, gender expression, gender identity, sexual orientation, or any other characteristic protected by local law, regulation, or ordinance.\n\n#J-18808-Ljbffr","datePosted":"2026-06-17T04:12:00.752Z","dateModified":"2026-06-17T04:12:00.752Z","hiringOrganization":{"@type":"Organization","name":"Intel","sameAs":"https://jobsearcher.com"},"jobLocation":{"@type":"Place","address":{"@type":"PostalAddress","addressLocality":"Chandler","addressRegion":"AZ","addressCountry":"US"}},"identifier":{"@type":"PropertyValue","name":"JobSearcher","value":"0b3f98fe0468e57855bd4a9e"},"url":"https://jobsearcher.com/jobs/0b3f98fe0468e57855bd4a9e"}}