{"schemaVersion":"jobsearcher.job.v1","id":"0afecac0653cd4d2e31ed0e5","url":"https://jobsearcher.com/jobs/0afecac0653cd4d2e31ed0e5","canonicalUrl":"https://jobsearcher.com/jobs/0afecac0653cd4d2e31ed0e5","title":"Microelectronics Engineering Technician – Wire Bonding & Precision Assembly","description":"CTG is seeking to fill a *Microelectronics Engineering Technician – Wire Bonding & Precision Assembly* position for our client.\n\n*Location:* San Jose, CA\n*Duration:* 3 months\n\n*Duties:*\n\n* Perform precision wire bonding, automated bonding, and microelectronic assembly operations.\n* Operate and set up wire bonders, auto bonders, furnaces, loaders, and other specialized manufacturing equipment.\n* Inspect SMT, PCB assemblies, box builds, electronic components, and microelectronic assemblies using microscopes and magnification tools.\n* Perform First Article Inspection (FAI), IPC-610 inspections, lot sampling, pass/fail evaluations, and final product acceptance testing.\n* Conduct process testing and validation, including temperature control, peel testing on IC components, and customer simulation testing.\n* Verify Bills of Material (BOMs), engineering change notices, manufacturing processes, and production readiness requirements.\n* Document inspection results, defects, process deviations, and quality findings in accordance with established procedures.\n* Support failure analysis, root cause investigations, process audits, and continuous quality improvement activities.\n* Ensure manufacturing and inspection activities comply with engineering specifications, quality standards, and process requirements.\n\n*Skills:*\n\n* Wire Bonder and Auto Bonder operation\n* Precision mechanical tools and instruments\n* SMT and PCB assembly inspection\n* AOI (Automated Optical Inspection)\n* First Article Inspection (FAI)\n* IPC-610 standards\n* Microscope and magnification inspection\n* Electronic component and microelectronics inspection\n* Furnace setup, sintering, and loader machine operations\n* Process testing and validation\n* Peel testing on IC components\n* Quality control and quality assurance\n* Statistical and lot sampling techniques\n* MES and manufacturing process documentation\n* Defect detection, identification, and reporting\n* Process verification, compliance, and auditing\n\n*Experience:*\n\n* Minimum 5 years of experience working in a high-tech manufacturing environment, preferably in microelectronics, semiconductor, or medical device manufacturing.\n* Hands-on experience operating high-precision mechanical tools and wire bonding equipment is preferred.\n* Experience with precision assembly, inspection, quality verification, and manufacturing processes.\n* Experience working with microscopes and other magnification tools for detailed component inspection.\n* Ability to follow detailed manufacturing procedures, engineering specifications, and quality standards.\n* Experience documenting inspection results and supporting failure analysis or root cause investigations.\n\n*Education:*\n\n* Technical certification, associate degree, or coursework in electronics, microelectronics, manufacturing technology, or a related field is preferred.\n\nPay: $35.00 - $37.00 per hour\n\nWork Location: In person","company":"Ctg Computer Task Group","rawCompany":"ctg computer task group","city":"San Jose","state":"CA","isRemote":false,"isActive":false,"createdAt":"2026-09-06T13:28:48.669Z","occupations":[{"code":"51-2022.00","title":"Electrical and Electronic Equipment Assemblers","slug":"electrical-and-electronic-equipment-assemblers"},{"code":"51-9141.00","title":"Semiconductor Processing Technicians","slug":"semiconductor-processing-technicians"},{"code":"17-3023.00","title":"Electrical and Electronic Engineering Technologists and Technicians","slug":"electrical-and-electronic-engineering-technologists-and-technicians"}],"industries":[{"code":"334419","title":"Other Electronic Component Manufacturing","slug":"other-electronic-component-manufacturing"},{"code":"334418","title":"Printed Circuit Assembly (Electronic Assembly) Manufacturing","slug":"printed-circuit-assembly-electronic-assembly-manufacturing"},{"code":"334417","title":"Electronic Connector Manufacturing","slug":"electronic-connector-manufacturing"}],"jobPosting":{"@context":"https://schema.org","@type":"JobPosting","title":"Microelectronics Engineering Technician – Wire Bonding & Precision Assembly","description":"CTG is seeking to fill a *Microelectronics Engineering Technician – Wire Bonding & Precision Assembly* position for our client.\n\n*Location:* San Jose, CA\n*Duration:* 3 months\n\n*Duties:*\n\n* Perform precision wire bonding, automated bonding, and microelectronic assembly operations.\n* Operate and set up wire bonders, auto bonders, furnaces, loaders, and other specialized manufacturing equipment.\n* Inspect SMT, PCB assemblies, box builds, electronic components, and microelectronic assemblies using microscopes and magnification tools.\n* Perform First Article Inspection (FAI), IPC-610 inspections, lot sampling, pass/fail evaluations, and final product acceptance testing.\n* Conduct process testing and validation, including temperature control, peel testing on IC components, and customer simulation testing.\n* Verify Bills of Material (BOMs), engineering change notices, manufacturing processes, and production readiness requirements.\n* Document inspection results, defects, process deviations, and quality findings in accordance with established procedures.\n* Support failure analysis, root cause investigations, process audits, and continuous quality improvement activities.\n* Ensure manufacturing and inspection activities comply with engineering specifications, quality standards, and process requirements.\n\n*Skills:*\n\n* Wire Bonder and Auto Bonder operation\n* Precision mechanical tools and instruments\n* SMT and PCB assembly inspection\n* AOI (Automated Optical Inspection)\n* First Article Inspection (FAI)\n* IPC-610 standards\n* Microscope and magnification inspection\n* Electronic component and microelectronics inspection\n* Furnace setup, sintering, and loader machine operations\n* Process testing and validation\n* Peel testing on IC components\n* Quality control and quality assurance\n* Statistical and lot sampling techniques\n* MES and manufacturing process documentation\n* Defect detection, identification, and reporting\n* Process verification, compliance, and auditing\n\n*Experience:*\n\n* Minimum 5 years of experience working in a high-tech manufacturing environment, preferably in microelectronics, semiconductor, or medical device manufacturing.\n* Hands-on experience operating high-precision mechanical tools and wire bonding equipment is preferred.\n* Experience with precision assembly, inspection, quality verification, and manufacturing processes.\n* Experience working with microscopes and other magnification tools for detailed component inspection.\n* Ability to follow detailed manufacturing procedures, engineering specifications, and quality standards.\n* Experience documenting inspection results and supporting failure analysis or root cause investigations.\n\n*Education:*\n\n* Technical certification, associate degree, or coursework in electronics, microelectronics, manufacturing technology, or a related field is preferred.\n\nPay: $35.00 - $37.00 per hour\n\nWork Location: In person","datePosted":"2026-09-06T13:28:48.669Z","dateModified":"2026-09-06T13:28:48.669Z","hiringOrganization":{"@type":"Organization","name":"Ctg Computer Task Group","sameAs":"https://jobsearcher.com"},"jobLocation":{"@type":"Place","address":{"@type":"PostalAddress","addressLocality":"San Jose","addressRegion":"CA","addressCountry":"US"}},"identifier":{"@type":"PropertyValue","name":"JobSearcher","value":"0afecac0653cd4d2e31ed0e5"},"url":"https://jobsearcher.com/jobs/0afecac0653cd4d2e31ed0e5"}}