{"schemaVersion":"jobsearcher.job.v1","id":"0873b5d6e9dda813739af28c","url":"https://jobsearcher.com/jobs/0873b5d6e9dda813739af28c","canonicalUrl":"https://jobsearcher.com/jobs/0873b5d6e9dda813739af28c","title":"PCB Fabrication Process Engineer","description":"WHAT YOU DO AT AMD CHANGES EVERYTHING\r\nAt AMD, our mission is to build great products that accelerate next-generation computing experiences-from AI and data centers, to PCs, gaming and embedded systems. Grounded in a culture of innovation and collaboration, we believe real progress comes from bold ideas, human ingenuity and a shared passion to create something extraordinary. When you join AMD, you'll discover the real differentiator is our culture. We push the limits of innovation to solve the world's most important challenges-striving for execution excellence, while being direct, humble, collaborative, and inclusive of diverse perspectives. Join us as we shape the future of AI and beyond. Together, we advance your career.\r\nTHE ROLE\r\nWe are looking for a talented and energetic Lead Printed Circuit Board (PCB) fabrication process engineer to complement the existing skillsets of our Platform development team. In this role, you will be responsible for driving PCB performance, quality and reliability specifications: including but not limited to high-speed signal & power integrity (SI/PI) optimized stacks and interconnect structures for volume manufacturing. To accomplish this, you will interact frequently with key teams leading silicon/package design, board schematics/layout engineering, system validation, device failure analysis and supply chain/procurement activities within AMD, external industry consortiums, our customer teams, and strategic ODM & joint development partners.\r\nTHE PERSON\r\nAs a Leader in Systems Design Engineering, you will be responsible for ensuring best-in-class performance and reliability of cutting-edge PCB designs. The suitable candidate will require a strong background & solid understanding of complex fabrication processes, high performance electronics hardware, and technical expertise in assembly reliability test/failure analyses. Effective communication skills, a collaborative mindset, detail-orientation, innovative critical problem solving/ troubleshooting, and organized data collection are critical qualities for success in this role.\r\nKEY RESPONSIBILITIES\r\n\r\nDesign high performance material stacks & complex via-structure interconnects to enable AMD's next generation of Datacenter GPU Platform PCBs\r\nEffectively address/close Design for Manufacturing queries in a timely manner to mitigate fabrication yield issues & derisk on-schedule delivery of critical builds\r\nOwn the process qualification & adoption of PCB fabrication technologies required to address rapidly evolving Signal Integrity, Power Delivery, and Thermal-Mechanical related performance specifications\r\nDefine technology roadmaps, vendor engagements, and help implement robust architecture design practices for performance, cost, and manufacturability\r\nCollaborate with silicon/package design, board engineering/layout, and other cross-functional teams to enable PCB solutions from package to system level\r\nContribute to overall Platform quality from conceptualization/feasibility planning stage through NPI & mass volume production ramp\r\nDrive process improvements while executing fast time-to-market product delivery\r\nFunction decisively in a dynamic & fast-paced product development environment\r\n\r\nPREFERRED EXPERIENCE\r\n\r\nStrong background in high-speed design, robust strategies for PCIe & Memory routing, and optimal PCB material selection dependent on application end-use\r\nExpertise in destructive and non-destructive PCB failure/root cause analyses using 3DXRM, SEM, Thermal analysis (DSC, DMA...etc.), and FTIR Spectroscopy\r\nFamiliarity with 2D/3D Allegro (or other) Stack Impedance and Loss simulation tools required for SI/PI-focused interconnect optimizations\r\nAbility to write scripts in programming languages (i.e. Python, C/C++, MATLAB, etc.) for statistical data analysis & tool development\r\nExcellent verbal & written communication skills at engineering and executive levels, including a proven track record of working effectively across organizational boundaries to define process requirements, solve complex problems and drive program-related investigations to successful completion\r\nLaboratory Acumen - Experience with Design of Experiments, instrumentation, data acquisition and analyses, including uncertainty analysis\r\nPCB Manufacturing - Sound knowledge of design & fabrication guidelines, in-depth understanding of PCBA-related failure mechanisms including CAF, PTH/via cracking, pad cratering/solder ball stress, glass-stop & delamination risk and proven experience with volume manufacturing suppliers in Asia & North America\r\n\r\nACADEMIC CREDENTIALS\r\n\r\nRequired - Bachelor's degree in Engineering (Electrical/Computer/Mechanical/Chemical…etc.)\r\nPreferred - Master's degree in Electrical/Electronics & Computer Engineering\r\n\r\nThis role is not eligible for visa sponsorship.\r\nLI-KW1\r\nBenefits offered are described: AMD benefits at a glance.\r\nAMD does not accept unsolicited resumes from headhunters, recruitment agencies, or fee-based recruitment services. AMD and its subsidiaries are equal opportunity, inclusive employers and will consider all applicants without regard to age, ancestry, color, marital status, medical condition, mental or physical disability, national origin, race, religion, political and/or third-party affiliation, sex, pregnancy, sexual orientation, gender identity, military or veteran status, or any other characteristic protected by law. We encourage applications from all qualified candidates and will accommodate applicants' needs under the respective laws throughout all stages of the recruitment and selection process.\r\nAMD may use Artificial Intelligence to help screen, assess or select applicants for this position. AMD's \"Responsible AI Policy\" is available here.\r\nThis posting is for an existing vacancy.","company":"Advanced Micro Devices","rawCompany":"advanced micro devices","city":"Austin","state":"TX","isRemote":false,"isActive":false,"createdAt":"2026-04-25T04:52:28.799Z","occupations":[{"code":"17-2072.00","title":"Electronics Engineers, Except Computer","slug":"electronics-engineers-except-computer"},{"code":"17-2061.00","title":"Computer Hardware Engineers","slug":"computer-hardware-engineers"},{"code":"17-2112.03","title":"Manufacturing Engineers","slug":"manufacturing-engineers"}],"industries":[{"code":"334418","title":"Printed Circuit Assembly (Electronic Assembly) Manufacturing","slug":"printed-circuit-assembly-electronic-assembly-manufacturing"},{"code":"334111","title":"Electronic Computer Manufacturing","slug":"electronic-computer-manufacturing"},{"code":"334413","title":"Semiconductor and Related Device Manufacturing","slug":"semiconductor-and-related-device-manufacturing"}],"jobPosting":{"@context":"https://schema.org","@type":"JobPosting","title":"PCB Fabrication Process Engineer","description":"WHAT YOU DO AT AMD CHANGES EVERYTHING\r\nAt AMD, our mission is to build great products that accelerate next-generation computing experiences-from AI and data centers, to PCs, gaming and embedded systems. Grounded in a culture of innovation and collaboration, we believe real progress comes from bold ideas, human ingenuity and a shared passion to create something extraordinary. When you join AMD, you'll discover the real differentiator is our culture. We push the limits of innovation to solve the world's most important challenges-striving for execution excellence, while being direct, humble, collaborative, and inclusive of diverse perspectives. Join us as we shape the future of AI and beyond. Together, we advance your career.\r\nTHE ROLE\r\nWe are looking for a talented and energetic Lead Printed Circuit Board (PCB) fabrication process engineer to complement the existing skillsets of our Platform development team. In this role, you will be responsible for driving PCB performance, quality and reliability specifications: including but not limited to high-speed signal & power integrity (SI/PI) optimized stacks and interconnect structures for volume manufacturing. To accomplish this, you will interact frequently with key teams leading silicon/package design, board schematics/layout engineering, system validation, device failure analysis and supply chain/procurement activities within AMD, external industry consortiums, our customer teams, and strategic ODM & joint development partners.\r\nTHE PERSON\r\nAs a Leader in Systems Design Engineering, you will be responsible for ensuring best-in-class performance and reliability of cutting-edge PCB designs. The suitable candidate will require a strong background & solid understanding of complex fabrication processes, high performance electronics hardware, and technical expertise in assembly reliability test/failure analyses. Effective communication skills, a collaborative mindset, detail-orientation, innovative critical problem solving/ troubleshooting, and organized data collection are critical qualities for success in this role.\r\nKEY RESPONSIBILITIES\r\n\r\nDesign high performance material stacks & complex via-structure interconnects to enable AMD's next generation of Datacenter GPU Platform PCBs\r\nEffectively address/close Design for Manufacturing queries in a timely manner to mitigate fabrication yield issues & derisk on-schedule delivery of critical builds\r\nOwn the process qualification & adoption of PCB fabrication technologies required to address rapidly evolving Signal Integrity, Power Delivery, and Thermal-Mechanical related performance specifications\r\nDefine technology roadmaps, vendor engagements, and help implement robust architecture design practices for performance, cost, and manufacturability\r\nCollaborate with silicon/package design, board engineering/layout, and other cross-functional teams to enable PCB solutions from package to system level\r\nContribute to overall Platform quality from conceptualization/feasibility planning stage through NPI & mass volume production ramp\r\nDrive process improvements while executing fast time-to-market product delivery\r\nFunction decisively in a dynamic & fast-paced product development environment\r\n\r\nPREFERRED EXPERIENCE\r\n\r\nStrong background in high-speed design, robust strategies for PCIe & Memory routing, and optimal PCB material selection dependent on application end-use\r\nExpertise in destructive and non-destructive PCB failure/root cause analyses using 3DXRM, SEM, Thermal analysis (DSC, DMA...etc.), and FTIR Spectroscopy\r\nFamiliarity with 2D/3D Allegro (or other) Stack Impedance and Loss simulation tools required for SI/PI-focused interconnect optimizations\r\nAbility to write scripts in programming languages (i.e. Python, C/C++, MATLAB, etc.) for statistical data analysis & tool development\r\nExcellent verbal & written communication skills at engineering and executive levels, including a proven track record of working effectively across organizational boundaries to define process requirements, solve complex problems and drive program-related investigations to successful completion\r\nLaboratory Acumen - Experience with Design of Experiments, instrumentation, data acquisition and analyses, including uncertainty analysis\r\nPCB Manufacturing - Sound knowledge of design & fabrication guidelines, in-depth understanding of PCBA-related failure mechanisms including CAF, PTH/via cracking, pad cratering/solder ball stress, glass-stop & delamination risk and proven experience with volume manufacturing suppliers in Asia & North America\r\n\r\nACADEMIC CREDENTIALS\r\n\r\nRequired - Bachelor's degree in Engineering (Electrical/Computer/Mechanical/Chemical…etc.)\r\nPreferred - Master's degree in Electrical/Electronics & Computer Engineering\r\n\r\nThis role is not eligible for visa sponsorship.\r\nLI-KW1\r\nBenefits offered are described: AMD benefits at a glance.\r\nAMD does not accept unsolicited resumes from headhunters, recruitment agencies, or fee-based recruitment services. AMD and its subsidiaries are equal opportunity, inclusive employers and will consider all applicants without regard to age, ancestry, color, marital status, medical condition, mental or physical disability, national origin, race, religion, political and/or third-party affiliation, sex, pregnancy, sexual orientation, gender identity, military or veteran status, or any other characteristic protected by law. We encourage applications from all qualified candidates and will accommodate applicants' needs under the respective laws throughout all stages of the recruitment and selection process.\r\nAMD may use Artificial Intelligence to help screen, assess or select applicants for this position. AMD's \"Responsible AI Policy\" is available here.\r\nThis posting is for an existing vacancy.","datePosted":"2026-04-25T04:52:28.799Z","dateModified":"2026-04-25T04:52:28.799Z","hiringOrganization":{"@type":"Organization","name":"Advanced Micro Devices","sameAs":"https://jobsearcher.com"},"jobLocation":{"@type":"Place","address":{"@type":"PostalAddress","addressLocality":"Austin","addressRegion":"TX","addressCountry":"US"}},"identifier":{"@type":"PropertyValue","name":"JobSearcher","value":"0873b5d6e9dda813739af28c"},"url":"https://jobsearcher.com/jobs/0873b5d6e9dda813739af28c"}}