{"schemaVersion":"jobsearcher.job.v1","id":"07f96a209bac30bda8f135ba","url":"https://jobsearcher.com/jobs/07f96a209bac30bda8f135ba","canonicalUrl":"https://jobsearcher.com/jobs/07f96a209bac30bda8f135ba","title":"DRY ETCH PROCESS DEVELOPMENT ENGINEER (Reader)","description":"Under the direction of the Director of Dry Etch Process Development, the Dry Etch Process Development Engineer (Reader) is responsible for the developing and implementing new RIE, IBD, and Ashing processes for next generation magnetic recording heads, including implementing new process control schemes which ensure product manufacturability; designs and conducts experiments, analyzes data, and presents findings; researches, selects, and qualifies new tools which improve efficiency and yield. This position is located in Milpitas, California.\nESSENTIAL FUNCTIONS:\nDevelops and implements new dry etch processes (RIE, IBE, and Ashing) for next generation magnetic recording heads\nImplements new process control schemes or methodologies which ensure product manufacturability\nDesigns and conducts experiments, analyzes data, and develops recommendations for improving performance and yield while reducing scrap\nAdheres to appropriate timeline for introducing new processes into the manufacturing line\nReviews characterization data from FIB, SEM, and TEM tools to conduct root cause analysis and recommend corrective action\nPartners with other groups and departments, including process and product engineering to develop and deliver products and programs\nOversees the work of the Process Technicians to ensure accurate process execution and efficient wafer disposition\nPartners with Equipment Engineering to research, select, and qualify new RIE tools\nAdheres to all safety policies and procedures as required\nPerforms other duties of a similar nature or level*\nMINIMUM QUALIFICATIONS:\nBachelor’s degree in Materials Science, Physics, or Electrical Engineering and/or equivalent relevant experience; Master’s degree preferred\nThree years of experience working in the magnetic recording head, hard disk drive, or semiconductor industry as a Process Engineer\nExperience in plasma etch process development (RIE, IBE, Ashing, etc.) is preferred\nExperience working in a wafer fab manufacturing environment\nExperience with Statistical Process Control (SPC)\nProficient in the use of Microsoft Office Applications\nKnowledge, Skills, and Abilities:\nKnowledge of semiconductor or HDD industry principles, practices, and techniques\nKnowledge of wafer fabrication processing techniques, including process development and integration practices\nKnowledge of plasma etch (RIE, IBE, ashing, etc.) principles, practices, and techniques\nKnowledge of TEM, SEM, and FIB and ability to analyze data from these sources to determine root cause of failure\nKnowledge and ability to use Excel, JMP, or other software applications such as VBA to analyze data, create reports, present findings, and recommend appropriate action\nKnowledge and ability to use Microsoft Office applications to create reports and presentations\nAble to communicate effectively, both verbally and in writing, with all levels of contractors, consultants, employees, and management\nAble to work productively and collaboratively with all levels of employees and management\nAble to comply with all safety policies and procedures\nDemonstrated organizational and time management skills\nDemonstrated problem-solving and trouble shooting skills\nFlexible and able to prioritize\nThe annual base salary for this full-time position is between $96,655.20-$142,140.00 + bonus target + benefits. Within the range the individual pay may differ depending on additional factors including job responsibilities, job related knowledge, skills, abilities, education, and experience. The annual base pay range shown is subject to change and may be modified periodically.\nWORKING CONDITIONS:\nThe Dry Etch Manufacturing Engineer works primarily in an office environment from Monday thru Friday. The schedule may be altered from time-to-time to meet business or operational needs; may travel from building-to-building as needed. May also work in a class 100 ESD sensitive wafer fab manufacturing facility; adheres to required safety and dress standards. May be exposed to hazardous chemicals, fumes, or vapors and excessive noise from time-to-time while in the wafer manufacturing facility; stands and walks; performs various fine grasping movements, bends, and twists; operates a computer and enters information using a keyboard, operates a telephone, and other office equipment. May occasionally be required to push, pull, or lift up to 10 pounds.\nOther duties of a similar nature or level are duties that may be required, but may not be specifically listed in the job description or posting.\nTDK/Headway Technologies, Inc. provides equal employment opportunities (EEO) to all employees and applicants for employment without regard to race, color, religion, gender, national origin, age, disability, or genetics. Applicants requiring accommodation in order to complete the application process should contact the Headway Human Resources Department.","company":"Headway Technologies","rawCompany":"headway technologies","city":"Milpitas","state":"CA","isRemote":false,"isActive":false,"createdAt":"2026-04-14T11:14:28.485Z","occupations":[{"code":"51-9141.00","title":"Semiconductor Processing Technicians","slug":"semiconductor-processing-technicians"},{"code":"17-2072.00","title":"Electronics Engineers, Except Computer","slug":"electronics-engineers-except-computer"},{"code":"17-2131.00","title":"Materials Engineers","slug":"materials-engineers"}],"industries":[{"code":"334413","title":"Semiconductor and Related Device Manufacturing","slug":"semiconductor-and-related-device-manufacturing"},{"code":"334419","title":"Other Electronic Component Manufacturing","slug":"other-electronic-component-manufacturing"},{"code":"333242","title":"Semiconductor Machinery Manufacturing","slug":"semiconductor-machinery-manufacturing"}],"jobPosting":{"@context":"https://schema.org","@type":"JobPosting","title":"DRY ETCH PROCESS DEVELOPMENT ENGINEER (Reader)","description":"Under the direction of the Director of Dry Etch Process Development, the Dry Etch Process Development Engineer (Reader) is responsible for the developing and implementing new RIE, IBD, and Ashing processes for next generation magnetic recording heads, including implementing new process control schemes which ensure product manufacturability; designs and conducts experiments, analyzes data, and presents findings; researches, selects, and qualifies new tools which improve efficiency and yield. This position is located in Milpitas, California.\nESSENTIAL FUNCTIONS:\nDevelops and implements new dry etch processes (RIE, IBE, and Ashing) for next generation magnetic recording heads\nImplements new process control schemes or methodologies which ensure product manufacturability\nDesigns and conducts experiments, analyzes data, and develops recommendations for improving performance and yield while reducing scrap\nAdheres to appropriate timeline for introducing new processes into the manufacturing line\nReviews characterization data from FIB, SEM, and TEM tools to conduct root cause analysis and recommend corrective action\nPartners with other groups and departments, including process and product engineering to develop and deliver products and programs\nOversees the work of the Process Technicians to ensure accurate process execution and efficient wafer disposition\nPartners with Equipment Engineering to research, select, and qualify new RIE tools\nAdheres to all safety policies and procedures as required\nPerforms other duties of a similar nature or level*\nMINIMUM QUALIFICATIONS:\nBachelor’s degree in Materials Science, Physics, or Electrical Engineering and/or equivalent relevant experience; Master’s degree preferred\nThree years of experience working in the magnetic recording head, hard disk drive, or semiconductor industry as a Process Engineer\nExperience in plasma etch process development (RIE, IBE, Ashing, etc.) is preferred\nExperience working in a wafer fab manufacturing environment\nExperience with Statistical Process Control (SPC)\nProficient in the use of Microsoft Office Applications\nKnowledge, Skills, and Abilities:\nKnowledge of semiconductor or HDD industry principles, practices, and techniques\nKnowledge of wafer fabrication processing techniques, including process development and integration practices\nKnowledge of plasma etch (RIE, IBE, ashing, etc.) principles, practices, and techniques\nKnowledge of TEM, SEM, and FIB and ability to analyze data from these sources to determine root cause of failure\nKnowledge and ability to use Excel, JMP, or other software applications such as VBA to analyze data, create reports, present findings, and recommend appropriate action\nKnowledge and ability to use Microsoft Office applications to create reports and presentations\nAble to communicate effectively, both verbally and in writing, with all levels of contractors, consultants, employees, and management\nAble to work productively and collaboratively with all levels of employees and management\nAble to comply with all safety policies and procedures\nDemonstrated organizational and time management skills\nDemonstrated problem-solving and trouble shooting skills\nFlexible and able to prioritize\nThe annual base salary for this full-time position is between $96,655.20-$142,140.00 + bonus target + benefits. Within the range the individual pay may differ depending on additional factors including job responsibilities, job related knowledge, skills, abilities, education, and experience. The annual base pay range shown is subject to change and may be modified periodically.\nWORKING CONDITIONS:\nThe Dry Etch Manufacturing Engineer works primarily in an office environment from Monday thru Friday. The schedule may be altered from time-to-time to meet business or operational needs; may travel from building-to-building as needed. May also work in a class 100 ESD sensitive wafer fab manufacturing facility; adheres to required safety and dress standards. May be exposed to hazardous chemicals, fumes, or vapors and excessive noise from time-to-time while in the wafer manufacturing facility; stands and walks; performs various fine grasping movements, bends, and twists; operates a computer and enters information using a keyboard, operates a telephone, and other office equipment. May occasionally be required to push, pull, or lift up to 10 pounds.\nOther duties of a similar nature or level are duties that may be required, but may not be specifically listed in the job description or posting.\nTDK/Headway Technologies, Inc. provides equal employment opportunities (EEO) to all employees and applicants for employment without regard to race, color, religion, gender, national origin, age, disability, or genetics. Applicants requiring accommodation in order to complete the application process should contact the Headway Human Resources Department.","datePosted":"2026-04-14T11:14:28.485Z","dateModified":"2026-04-14T11:14:28.485Z","hiringOrganization":{"@type":"Organization","name":"Headway Technologies","sameAs":"https://jobsearcher.com"},"jobLocation":{"@type":"Place","address":{"@type":"PostalAddress","addressLocality":"Milpitas","addressRegion":"CA","addressCountry":"US"}},"identifier":{"@type":"PropertyValue","name":"JobSearcher","value":"07f96a209bac30bda8f135ba"},"url":"https://jobsearcher.com/jobs/07f96a209bac30bda8f135ba"}}