{"schemaVersion":"jobsearcher.job.v1","id":"04f073d3ee9c8c0f2e71b93f","url":"https://jobsearcher.com/jobs/04f073d3ee9c8c0f2e71b93f","canonicalUrl":"https://jobsearcher.com/jobs/04f073d3ee9c8c0f2e71b93f","title":"Mechanical Packaging Engineer","description":"Basic Qualification:\n10+ years of Industry experience in electronics packaging\nBachelors/Masters in Mechanical Engineering\nSolid communication, writing skills and teaming skills are a must.\nRequired Skills :-\nDesign of Sheet Metal and Machined elements (Enclosures, Covers etc) for electronics packaging and test fixtures.\nMechanical design of Printed Circuit Card (PCB) and Circuit Card Assembly (CCA) -- per IPC standard.\nKnowledge on Material grades, heat-treatment Process and Finish process in according with Military and Aerospace Methods.\nImplementation of the thermal management approaches like Conduction and Natural & Forced convection.\nVibration, stress and thermal analysis and design solutions.\nMechanical Packaging Design for Electromagnetic interference (EMI) and Electromagnetic compatibility (EMC).\nDesign for Environmental Conditions (per DO-160, MIL-810 standards) and testing\nDetermining HALT/ ESS profile and testing\nImplementation of DFM (Design for manufacturing), DFA (Design for assembly) concepts.\nDesign for Environment (REACH, RoHS).\nSelection of materials and components as per INDUSTRY / MILITARY standards\n3D CAD model and 2D drawing creation in UGNX\nImplementation of basic Geometric dimensioning & Tolerance principles (per ASME Y 14.5 standard)\nJob Role :\nDesign and Development of Mechanical Packaging of Electronics unit for AIRBORNE and GROUND systems\nGenerate Electronic packaging designs data (3D and 2D CAD drawings) as per governing standards.\nManage design data in Product life cycle management (PLM) system like Team center\nGenerate Bill of material and other engineering documentation (Reports Etc.)\nWork closely with ECAD, MCAD and Electronics Design Team\nConduct / Contribute to design reviews (Functional, Cross-Functional: Internal, External) per defined product development process.\nGenerate and manage work breakdown plan for allocated project or task. Support project management in plan development with proper estimates and timelines.\nProvide engineering support during different product lifecycle phases: Prototyping, Manufacturing and In-service Etc.\nSupport configuration management activities for design upgrades and releases.\nSupport / Perform developmental testing, qualification and certification of the product.\nSupport internal and external audits.\nTest Engineering Support.\nUS Citizen or Green Card holder due to ITAR restrictions.\nJob Type: Full-time\nPay: $62,752.17 - $75,572.51 per year\nApplication Question(s):\nAre you a US Citizen or Green Card Holder?\nWhat is your salary expectation for a new role?\nAbility to Commute:\nRockford, IL (Required)\nWork Location: In person","company":"Cyient","rawCompany":"cyient","city":"Bloomington","state":"IL","isRemote":false,"isActive":false,"createdAt":"2026-04-12T21:09:23.944Z","occupations":[{"code":"17-2141.00","title":"Mechanical Engineers","slug":"mechanical-engineers"},{"code":"17-2199.00","title":"Engineers, All Other","slug":"engineers-all-other"},{"code":"17-2072.00","title":"Electronics Engineers, Except Computer","slug":"electronics-engineers-except-computer"}],"industries":[{"code":"333993","title":"Packaging Machinery Manufacturing","slug":"packaging-machinery-manufacturing"},{"code":"334418","title":"Printed Circuit Assembly (Electronic Assembly) Manufacturing","slug":"printed-circuit-assembly-electronic-assembly-manufacturing"},{"code":"561910","title":"Packaging and Labeling Services","slug":"packaging-and-labeling-services"}],"jobPosting":{"@context":"https://schema.org","@type":"JobPosting","title":"Mechanical Packaging Engineer","description":"Basic Qualification:\n10+ years of Industry experience in electronics packaging\nBachelors/Masters in Mechanical Engineering\nSolid communication, writing skills and teaming skills are a must.\nRequired Skills :-\nDesign of Sheet Metal and Machined elements (Enclosures, Covers etc) for electronics packaging and test fixtures.\nMechanical design of Printed Circuit Card (PCB) and Circuit Card Assembly (CCA) -- per IPC standard.\nKnowledge on Material grades, heat-treatment Process and Finish process in according with Military and Aerospace Methods.\nImplementation of the thermal management approaches like Conduction and Natural & Forced convection.\nVibration, stress and thermal analysis and design solutions.\nMechanical Packaging Design for Electromagnetic interference (EMI) and Electromagnetic compatibility (EMC).\nDesign for Environmental Conditions (per DO-160, MIL-810 standards) and testing\nDetermining HALT/ ESS profile and testing\nImplementation of DFM (Design for manufacturing), DFA (Design for assembly) concepts.\nDesign for Environment (REACH, RoHS).\nSelection of materials and components as per INDUSTRY / MILITARY standards\n3D CAD model and 2D drawing creation in UGNX\nImplementation of basic Geometric dimensioning & Tolerance principles (per ASME Y 14.5 standard)\nJob Role :\nDesign and Development of Mechanical Packaging of Electronics unit for AIRBORNE and GROUND systems\nGenerate Electronic packaging designs data (3D and 2D CAD drawings) as per governing standards.\nManage design data in Product life cycle management (PLM) system like Team center\nGenerate Bill of material and other engineering documentation (Reports Etc.)\nWork closely with ECAD, MCAD and Electronics Design Team\nConduct / Contribute to design reviews (Functional, Cross-Functional: Internal, External) per defined product development process.\nGenerate and manage work breakdown plan for allocated project or task. Support project management in plan development with proper estimates and timelines.\nProvide engineering support during different product lifecycle phases: Prototyping, Manufacturing and In-service Etc.\nSupport configuration management activities for design upgrades and releases.\nSupport / Perform developmental testing, qualification and certification of the product.\nSupport internal and external audits.\nTest Engineering Support.\nUS Citizen or Green Card holder due to ITAR restrictions.\nJob Type: Full-time\nPay: $62,752.17 - $75,572.51 per year\nApplication Question(s):\nAre you a US Citizen or Green Card Holder?\nWhat is your salary expectation for a new role?\nAbility to Commute:\nRockford, IL (Required)\nWork Location: In person","datePosted":"2026-04-12T21:09:23.944Z","dateModified":"2026-04-12T21:09:23.944Z","hiringOrganization":{"@type":"Organization","name":"Cyient","sameAs":"https://jobsearcher.com"},"jobLocation":{"@type":"Place","address":{"@type":"PostalAddress","addressLocality":"Bloomington","addressRegion":"IL","addressCountry":"US"}},"identifier":{"@type":"PropertyValue","name":"JobSearcher","value":"04f073d3ee9c8c0f2e71b93f"},"url":"https://jobsearcher.com/jobs/04f073d3ee9c8c0f2e71b93f"}}