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Strong hands-on experience with film characterization instrumentation and techniques such as XRD, XPS, XRF, Raman spectroscopy, UV/Vis spectrophotometry and AFM.Strong knowledge of nanofabrication and general device design and operation.
$127,000 - $165,000 a yearFull-timeExpandApply NowActive JobUpdated Today - UpvoteDownvoteShare Job
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In addition to the above, the successful candidate(s) will work closely within the respective team, and with the research group and collaborators, conducting a variety of materials characterization techniques (including SEM, XRD, Raman, XPS, EDS, PSD, BET, tap density, EIS, etc.
$51,491 - $84,950 a yearExpandApply NowActive JobUpdated Today - UpvoteDownvoteShare Job
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Hands on experience with Surface Analysis techniques - including (but not limited to) X-ray Photoelectron Spectroscopy (XPS), X-ray Reflectivity (XRR), X-ray Diffraction (XRD), Auger Electron Spectroscopy AES), Secondary Ion Mass Spectrometry (SIMS), Electrical Characterization, Physical/Mechanical Characterization, Thermal Analysis, Scanning Electron Microscopy (SEM), Electron Dispersive Spectroscopy (EDS), and Electron Backscatter Diffraction Spectroscopy (EBSD.
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Solid foundation of using material characterization techniques needed for understanding materials interaction with device performance:STEM, EDS, SIMS, PL, XRD, CV, Eddy Current, XPS, etc. Areas of competence should include CAD-layout, Etch, Photolithography, Metal Deposition, Diffusion, Wet Processing, Implant, NPI, SPC, DOE's and backend processing.
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Working with outside labs to perform SEM/XPS and AA analytical methods to obtain test results for sample characterization and problem solving. Coordinate with and managing outside testing laboratories to perform destructive and non-destructive testing, heat treatment, diffusible hydrogen testing, chemical analysis, and all other related testing.
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Failure Analysis analytical techniques (Optical Microscopy, X-Ray, CSAM, SEM/EDS, FTIR, XPS etc) Failure Analysis analytical techniques (Optical Microscopy, X-Ray, CSAM, SEM/EDS, FTIR, XPS etc.
$183,400 - $316,900 a yearExpandApply NowActive JobUpdated Today - UpvoteDownvoteShare Job
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Expertise with various analytical instrumentation techniques to include but not limited to the following: Nuclear Magnetic Resonance (NMR), Scanning Electron Microscopy (SEM), X-Ray Diffraction (XRD), X-ray Photoelectron Spectroscopy (XPS) and Ultraviolet-Visible Spectroscopy (UV-VIS.
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The Application Engineer is the subject matter expert for welding filler metal products. Historically talented at restoring distressed companies, Heico strategically targets acquisitions that will complement its ever-growing portfolio of companies in manufacturing, construction, and industrial services.
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Working knowledge of common thin-film characterization techniques including: XRR, XRD, XRF, Ellipsometry, Auger, SIMS, RBS, XPS. Working knowledge of common thin-film characterization techniques including: XRR, XRD, XRF, Ellipsometry, Auger, SIMS, RBS, XPS.
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Film characterization techniques and process monitoring including ellipsometry, SEM, XPS, etc. Experience with Zemax, COMSOL or equivalent modeling programs. Experience or familiarity with the following Tools/Processes: Atomic Layer Deposition, Ultra-High Vacuum Systems, common MEMS / semiconductor processes and general cleanroom environments.
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The ideal candidate can demonstrate a technical mastery of semiconductor metrology techniques such as scatteronetry, elliosonetry, XPS and an understanding of a balanced scorecard approach to develop, sustain, and improve semiconductor technologies with quality, cost, and delivery all considered.
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Further develop interpretation of data from other spectroscopy techniques, including but not limited to XPS, UV-vis, fluorescence, atomic absorption, etc. Procure, support installation and qualification of new spectroscopy tools (e.g. ToF-SIMS, FTIR, Raman, etc.
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The prospective candidate is expected to have strong expertise in contaminant chemistry, analytical skills (GC-MS and HPLC-MS), material characterization (BET, XRD, FT-IR, XPS), and environmental remediation (batch sorption and column transport studies.
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The Mechanical Engineer is providing manufacturing support as a Subject Matter Expertise on the XPS Foam process, maintaining OC IP for the XPS Foam equipment and system design, supporting TPM efforts, supporting XPS Foam production sites, and supporting blowing agent safety systems to meet OSHA PSM design requirements.
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Experience in spectroscopic techniques (FTIR, Raman, UV-Vis, XRF, XPS, ICP-OES, etc.) Experience in spectroscopic techniques (FTIR, Raman, UV-Vis, XRF, XPS, ICP-OES, etc.) RESPONSIBILITIES : Perform routine analytical tests including but not limited to Spectroscopic techniques (FTIR, micro-FTIR, Raman, NMR) and product performance testing, prototyping, etc.
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