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Hybrid Assembly & Microelectronics Packaging Engineer
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- The Johns Hopkins Applied Physics Laboratory (APL) is focused on creating defining innovations that ensure our nation 's preeminence in the 21st century.
- We are actively seeking a Hybrid Assembly and Microelectronics Packaging Engineer, for the Advanced Electrical Fabrication Group.
- This is a unique opportunity to apply a passion for microelectronics packaging toward advanced prototypes and one-of-a kind systems that will further the scientific knowledge of humankind, safeguard our nation's security, and advance the frontiers of space.
- As a Hybrid Assembly & Microelectronics Packaging Engineer
- You will be responsible for hands-on microelectronics and hybrid assembly work, especially with a new process or assembly.
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